PRINTED CIRCUIT SUBSTRATE

Title:

PRINTED CIRCUIT SUBSTRATE

Document Type and Number:

Japanese Patent JPH04267589

Kind Code:

A

Abstract:

PURPOSE: To eliminate heat dissipation of a lead connecting bonding tool of an electronic component and to prevent damage of a printed circuit substrate in a printed circuit substrate used widely for a circuit configuration of various types of electronic equipment.

CONSTITUTION: In a multilayer printed substrate in which a pair of surface layers to become front and rear surfaces and a plurality of inner layers are laminated, a power source layer 12-2a in which an area for forming an electronic component connecting foot print 2-1a formed on the surface layer 2-1 and a conductor of a position corresponding to the area are removed, is provided on the inner layer 12-2.

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Inventors:

OKADA HIROYUKI
TASHIRO JUNICHI
KIRA HIDEHIKO

Application Number:

JP2851391A

Publication Date:

September 24, 1992

Filing Date:

February 22, 1991

Export Citation:

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Assignee:

FUJITSU LTD

International Classes:

H05K3/46; (IPC1-7): H05K3/46

Domestic Patent References:

JPS61109169A

1986-05-27

Attorney, Agent or Firm:

Sadaichi Igita

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