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Patent Searching and Data


Title:
PRODUCTION OF POLYAMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH06271769
Kind Code:
A
Abstract:

PURPOSE: To obtain a polyamide resin composition which gives a molding excellent in mechanical properties, heat resistance, and chemical resistance by incorporating a given copolyamide resin into a composition comprising a specific polyamide resin and a fibrous reinforcement.

CONSTITUTION: 100 pts.wt. composition comprising 40-99wt.% aliphatic polyamide having a terminal COOH content of 3×10-5 to 20×10-5eq/g (e.g. nylon 6) and 1-60wt.% fibrous reinforcement (e.g. glass fibers) is kneaded with 10-900 pts.wt. crystalline half-aromatic copolyamide resin comprising 20-90wt.% hexamethylenephthalamide units and 10-80wt.% units of another amide (e.g. hexamethyleneadipamide).


Inventors:
ONISHI KOJI
MURATA KOZO
IWAMOTO MASAAKI
Application Number:
JP6371793A
Publication Date:
September 27, 1994
Filing Date:
March 23, 1993
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
C08K7/02; C08L77/00; (IPC1-7): C08L77/00; C08K7/02