To provide a removing jig, a removing method and device of BGA, in order to solve the problem wherein the temperature difference between the parts decreases at the the using of lead-free soldering and the like, while removing easily BGA mounted in a printed circuit board, in relation to the removing jig, the removing method and device of BGA (Ball Grid Array) mounted on the surface of the printed circuit board.
The removing jig is provided with two holding plates comprising legs sandwiching two sides of BGA to be removed, and an oblong body extended in the rectangular direction to the legs, an adjustment part for adjusting the gap of the holding plates arbitrarily, and short claws provided inside each leg of two holding plates facing each other and extended at right angles.
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AOKI FUMIO
TERAUCHI HIDEAKI
Akira Yamatani
Yoshiyoshi Ogasawara
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