Title:
半導体チップの製造方法
Document Type and Number:
Japanese Patent JP7241744
Kind Code:
B2
Abstract:
Provided is a method of manufacturing a semiconductor chip that comprises the following steps (1) to (3) using an adhesive sheet which includes a base (Y) having an expandable base layer (Y1) containing expandable particles and a non-expandable base layer (Y2), and on respective sides of the base (Y), a first adhesive layer (X1) in which protrusions may form in the adhesive surface , due to the expansion of the expandable particles, and a second adhesive layer (X2). ∙ Step (1): A step of affixing the first adhesive layer (X1) to a hard support and affixing the second adhesive layer (X2) to the surface of a semiconductor wafer. ∙ Step (2): A step of obtaining a plurality of semiconductor chips. ∙ Step (3): A step of expanding the expandable particles and separating the hard support from the first adhesive layer (X1) at an interface P.
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Inventors:
Tadatomo Yamada
Shinya Taku
Shinya Taku
Application Number:
JP2020518271A
Publication Date:
March 17, 2023
Filing Date:
April 26, 2019
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
H01L21/301; C09J7/20; C09J7/38
Domestic Patent References:
| JP2003292916A | ||||
| JP2002121510A | ||||
| JP2003306653A | ||||
| JP2009035635A | ||||
| JP2013203799A | ||||
| JP2015005598A | ||||
| JP2017002190A |
Attorney, Agent or Firm:
Patent Attorney Corporation Otani Patent Office