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Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2014236150
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device in which the current capacity is increased as a whole semiconductor device, by constituting the semiconductor device of a plurality of semiconductor modules, and interconnection of the terminals thereof is performed by a joining system optimal for the semiconductor device.SOLUTION: A semiconductor device includes a semiconductor module 10 having external connection terminals projecting from a case, bus bars 3A, 3B, 3C for coupling and electrically connecting the specific external connection terminals 16, 17, 18 in a plurality of semiconductor modules 10 arranged in parallel, and a semiconductor module case 2 for covering and fixing the plurality of semiconductor modules 10 coupled by means of the bus bars 3A, 3B, 3C. The bus bars 3A, 3B, 3C and the external connection terminals 16, 17, 18 of the semiconductor module are joined by laser welding.

Inventors:
TADA SHINJI
MOCHIZUKI EIJI
NAKAMURA HIDEYO
HORIO MASASHI
Application Number:
JP2013117916A
Publication Date:
December 15, 2014
Filing Date:
June 04, 2013
Export Citation:
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Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H01L25/07; H01L25/18
Domestic Patent References:
JP2011142124A2011-07-21
JP2013074712A2013-04-22
JP2012054449A2012-03-15
JP2012044140A2012-03-01
JP2004064954A2004-02-26
JP2008098586A2008-04-24
JPH0765878A1995-03-10
Attorney, Agent or Firm:
Ichiro Honda
Sugimoto Yumiko
Junro Shinoda
渡耒 巧
Ota black 隆