To solve the reliability problem of a semiconductor device employing a thin and lightweight package caused by the warp of the package or the difference of thermal expansion coefficient between the device and a mounting board, e.g. the breaking of a conduction line provided in the semiconductor device or the failure of connection with a thin metal wire.
The conduction line 40 composed of a crystal larger in the X axis-Y axis direction than in the Z axis direction is buried in an insulating resin 44 and the back of the conduction line 40 is exposed from the insulating resin 44 thus providing a sealed semiconductor device. The breaking of the conduction line 40 buried in the insulating resin 44 can thereby be suppressed.
COPYRIGHT: (C)2004,JPO
Yoshiyuki Kobayashi
Junji Sakamoto
Shigeaki Mashita
Katsumi Okawa
Eiju Maehara
Koji Takahashi
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Katsuhiko Sudo