Title:
半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP4635410
Kind Code:
B2
Abstract:
A semiconductor apparatus in which a conducting path formed from organic semiconductor molecules as a material has a novel structure and exhibits high mobility, and a manufacturing method for fabricating the same. Fine particles (8) comprised of a conductor, such as Au, or a semiconductor and organic semiconductor molecules (9), such as 4,4'-biphenyldithiol, are alternately bonded through a functional group at both terminals of the organic semiconductor molecules (9) to form a conducting path in a network form such that the conducting path in the fine particles (8) and the conducting path in the organic semiconductor molecules (9) are two-dimensionally or three-dimensionally linked together. This conducting path includes no intermolecular electron transfer, and the mobility is not restricted by the intermolecular electron transfer, and therefore the mobility of the conducting path along the main chain in the organic semiconductor molecules (in the direction of the axis of the molecule), for example, high intramolecular mobility due to delocalized À electrons can be fully utilized.
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Inventors:
Masaru Wada
Shinichiro Kondo
Ryoichi Yasuda
Shinichiro Kondo
Ryoichi Yasuda
Application Number:
JP2003184860A
Publication Date:
February 23, 2011
Filing Date:
June 27, 2003
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L29/786; H01L51/05; H01L21/00; H01L21/336; H01L29/76; H01L29/78; H01L35/24; H01L51/00; H01L51/30; H01L51/40
Domestic Patent References:
| JP2004006827A | ||||
| JP2005531132A |
Attorney, Agent or Firm:
Koichi Mori
Hiroshi Osaka
Hiroshi Osaka