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Title:
シート状接着剤及びウエハ加工用テープ
Document Type and Number:
Japanese Patent JP4851579
Kind Code:
B2
Abstract:
The invention provides a lamelliform adhesive which has excellent cohesive force between a semiconductor chip and a lead frame or a packaging substrate and can capture ionic impurities within the adhesive layer, an adhesive tape for wafer processing manufactured by the lamelliform adhesive, and a semiconductor device manufactured by the lamelliform adhesive. The lamelliform adhesive 12 contains a chelate-modified cured resin which is modified by a chelating agent and is used as an adhesive layer composition; the mixing ratio of the chelate-modified epoxy resin relative to the cured resin component is below 10 wt%; and the component amount of a high molecular weight compound with a weight average molecular weight of above 100 thousand is 40-100 parts by weight relative to the component amount of the cured resin of 100 parts by weight.

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Inventors:
Kunihiko Ishiguro
Yasumasa Morishima
Shinichi Ishiwata
Application Number:
JP2009263578A
Publication Date:
January 11, 2012
Filing Date:
November 19, 2009
Export Citation:
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Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
H01L21/301; C09J7/00; C09J7/02; C09J11/04; C09J133/00; C09J163/00; H01L21/52
Domestic Patent References:
JP7118365A
JP2008239890A
JP2006169446A
Attorney, Agent or Firm:
Ryo Matsushita



 
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