SOL-GEL COMPOSITION AND POLYMERIC IONICALLY CONDUCTIVE FILM PRODUCED THEREFROM

Japanese Patent JPH11166114

A

To obtain a composition which can give a polymeric ionically conductive film having excellent mechanical properties and adhesive force and high ionic conductivity at ordinary temperature by including a specified amount of a specified polyalkylene-glycol-substituted trialkoxysilane, a specified amount of a specified tetraalkoxysilane, a specified amount of a specified polyalkylene glycol, hydrochloric acid, and an organic solvent.

This composition comprises 1-90 wt.% polyalkylene-glycol- substituted trialkoxysilane represented by the formula, 10-90 wt.% tetraalkoxysilane, 1-90 wt.% polyalkylene glycol and/or alkyl ether represented by the formula: R2-O-(CR32-CR32-O)z-R2, hydrochloric acid. an organic solvent, and, optionally, 1-70 wt.% alkali metal salt represented by the formula: A+B. In the formulas, R is a 1-10C alkyl; x is l-10; R1 is R or -(CR32-CR32-O)y-R; y and z are each 1-50; R2 is H or R; R3 is H, CH3, or F; A+ is Li+, Na+, K+, or the like; B is ClO4, CF3SO3, N(CF3SO3)2, BF4, PF6, AsF6, or the like.

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KIM EUNKYOUNG
LEE MYONG-HOON
KO SEITAI
LEE KWANG-SUP
KAN RYUHO
RHEE SUH BONG
RI SHOCHIN

JP22823898A

June 22, 1999

August 12, 1998

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KOREA RES INST CHEM TECHNOL

B05D5/12; C08K3/04; C08K3/24; C08K3/36; C08K5/5419; C08L71/02; C08L83/00; C08L83/12; H01M6/18; H01M10/05; H01M10/0565; H01M6/40; (IPC1-7): C08L71/02; B05D5/12; C08K3/04; C08K3/24; C08K3/36; C08K5/54

Akira Asamura (3 outside)

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