Title:
SPUTTERING DEVICE AND METHOD OF MANUFACTURING FILM
Document Type and Number:
Japanese Patent JP2019094534
Kind Code:
A
Abstract:
To perform film deposition with good reproducibility in film thickness in continuous film deposition lasting for a long period.SOLUTION: A sputtering device comprises: a chamber in which an object of film deposition and a target are arranged; a reactive gas supply part which supplies a reactive gas into the chamber; an inert gas supply part which supplies an inert gas into the chamber; a power source which supplies electric power to the target to generate plasma in the chamber, and causes an ion of the inert gas in the plasma to strike on the target; a light reception part which receives light that the plasma emits; and a control part which uses a predetermined function, in which output of the power source in a compound mode, output of the power source in a transition mode, and a film deposition speed are made to correspond to one another, so as to control at least one of a flow rate of the reactive gas and a flow rate of the inert gas so that intensity of the light approximates target light intensity.SELECTED DRAWING: Figure 4
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Inventors:
TODO SOYA
Application Number:
JP2017223897A
Publication Date:
June 20, 2019
Filing Date:
November 21, 2017
Export Citation:
Assignee:
CANON KK
International Classes:
C23C14/54; C23C14/10; C23C14/34
Attorney, Agent or Firm:
Takuma Abe
Sogo Kuroiwa
Sogo Kuroiwa