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Patent Searching and Data


Title:
STRUCTURE AND METHOD FOR CONNECTING INTERCONNECTING SUBSTRATE
Document Type and Number:
Japanese Patent JPH07231010
Kind Code:
A
Abstract:

PURPOSE: To reduce the pressure load and prevent poor continuity of terminal connection parts by reducing the pressure dispersion at connection of connecting terminals through anisotropic conductive rubber connectors in a terminal connection of electronic parts on one interconnecting substrate with those on other substrate.

CONSTITUTION: An interconnecting substrate 1 having nearly flat connecting terminals 3 to be connected to other interconnecting substrate 2 comprises protrusions 5 on the terminals 3. The terminals 3 having the protrusions 5 and nearly flat connecting terminals 4 of the other substrate 2 are pressed through anisotropic conductive rubber connectors 6 to thereby connect through point contacts of the connectors 6 with the protrusions 5.


Inventors:
IIJIMA TAKESHI
Application Number:
JP4308594A
Publication Date:
August 29, 1995
Filing Date:
February 16, 1994
Export Citation:
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Assignee:
CASIO COMPUTER CO LTD
International Classes:
H01L21/60; H05K1/14; H05K3/32; H05K3/36; (IPC1-7): H01L21/60; H05K1/14