Title:
基板処理装置および配管アセンブリ
Document Type and Number:
Japanese Patent JP7304799
Kind Code:
B2
Abstract:
A substrate processing apparatus includes a conductive enclosure having a gas passage, a conductive member having a gas passage, and a piping assembly including a hollow tube having an inner sidewall, a core block disposed in the hollow tube, the core block having an outer sidewall fitting the inner sidewall of the hollow tube, the core block having a first dielectric constant, and at least one dielectric member disposed in at least one of the hollow tube and the core block, the dielectric member having a second dielectric constant higher than the first dielectric constant.
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Inventors:
Kazuki Oshima
Application Number:
JP2019215691A
Publication Date:
July 07, 2023
Filing Date:
November 28, 2019
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/3065
Domestic Patent References:
| JP2019149422A | ||||
| JP2015072885A | ||||
| JP11262143A |
Foreign References:
| WO2003046969A1 | ||||
| US20110075313 | ||||
| WO2013051248A1 |
Attorney, Agent or Firm:
Sakai International Patent Office