Title:
SUBSTRATE TREATMENT EQUIPMENT
Document Type and Number:
Japanese Patent JP2001267394
Kind Code:
A
Abstract:
To provide a substrate treatment equipment provided with a substrate transfer mechanism, having a hand which can realize the increase in yield of the manufacture of a semiconductor device, such as a VLSI or the like by preventing generation of particles due to mechanical friction between an inner wall of a counterbore of a robot hand and an end face of a wafer.
The substrate treatment equipment is so structured that DA< DS<DB, where the inner diameter of a counterbore 23 of a susceptor 20 is DS, the inner diameter of a counterbore 22 of a wafer delivery hand 17 for delivering a wafer 19 to the susceptor 20 is DA, and the inner diameter of a counterbore 24 of a wafer receiving hand 18 for receiving the wafer 19 from the susceptor 20 is DB.
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Inventors:
MAKIGUCHI KAZUMASA
Application Number:
JP2000081242A
Publication Date:
September 28, 2001
Filing Date:
March 23, 2000
Export Citation:
Assignee:
HITACHI INT ELECTRIC INC
International Classes:
B65G49/07; B25J15/08; H01L21/205; H01L21/302; H01L21/3065; H01L21/677; H01L21/68; (IPC1-7): H01L21/68; B25J15/08; B65G49/07; H01L21/205; H01L21/3065
Attorney, Agent or Firm:
Haruhiko Miyamoto