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Patent Searching and Data


Title:
THICK FILM HYBRID INTEGRATED CIRCUIT
Document Type and Number:
Japanese Patent JPH01292894
Kind Code:
A
Abstract:

PURPOSE: To prevent electrical and magnetic induction from being generated mutually between thick-film printed-circuit boards by providing a spacer at the bonding part of the printed-circuit boards.

CONSTITUTION: A surface mounting parts 4 are mounted on two thick-film printed-circuit boards 1 and 2, a spacer 6 is sandwiched and applied to between the thick-film printed-circuit boards 1 and 2, and a clip terminal 5 for external connection is mounted. Thus, by inserting the spacer 6, when applying electrical and magnetic induction thick-film printed-circuit boards between the thick-film printed-circuit boards 1 and 2, generation of electrical and magnetic induction between the thick-film printed-circuit boards can be prevented by inserting spacer on the bonding surface.


Inventors:
KONO JUNICHI
SHIMODA HIRONORI
Application Number:
JP12311488A
Publication Date:
November 27, 1989
Filing Date:
May 20, 1988
Export Citation:
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Assignee:
NEC CORP
International Classes:
H05K9/00; H01L25/16; H05K3/46; (IPC1-7): H05K3/46; H05K9/00
Attorney, Agent or Firm:
Uchihara Shin