PURPOSE: To prevent electrical and magnetic induction from being generated mutually between thick-film printed-circuit boards by providing a spacer at the bonding part of the printed-circuit boards.
CONSTITUTION: A surface mounting parts 4 are mounted on two thick-film printed-circuit boards 1 and 2, a spacer 6 is sandwiched and applied to between the thick-film printed-circuit boards 1 and 2, and a clip terminal 5 for external connection is mounted. Thus, by inserting the spacer 6, when applying electrical and magnetic induction thick-film printed-circuit boards between the thick-film printed-circuit boards 1 and 2, generation of electrical and magnetic induction between the thick-film printed-circuit boards can be prevented by inserting spacer on the bonding surface.
JP7208032 | semiconductor equipment |
JPH0992997 | MANUFACTURE OF SHIELDING PLATE FOR MULTILAYER FLEXIBLE WIRING BOARD |
JP2020009974 | HEAT TRANSFER COMPOSITION |
SHIMODA HIRONORI
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