PURPOSE: To provide a thick film/thin film mixed multilayred circuit which can deal with the increase of signal terminals and can reduce the propagation delay of signals even when the thickness of the thick film board is enlarged.
CONSTITUTION: In the thick film/thin film mixed multilayer circuit board forming a thin film part 22 equipped with plural wires on the surface of a thick film part 12 and providing a through hole for pulling a part of those wires from the back of the thick film part 12 to the outside in the thick film part 12, the thin film part 22 is formed only in a part of the surface of the thick film part 12 and the thick film part 12 is equipped with the wires inside. Then, one terminal of the wire is connected to a part of the wire in the thin film part 22 and the other terminal is pulled out to the surface of the thick film part 23 where the thin film part 22 is not formed.
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NARIZUKA YASUNORI
YAMAMURA HIDEO
