Title:
半導体素子収納用パッケージ
Document Type and Number:
Japanese Patent JP4454164
Kind Code:
B2
More Like This:
Inventors:
Nakashima Rira
Manabu Miyaishi
Manabu Miyaishi
Application Number:
JP2001019157A
Publication Date:
April 21, 2010
Filing Date:
January 26, 2001
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/06; H01L23/12; H01L23/14; H01L23/36
Domestic Patent References:
| JP61096047A | ||||
| JP5326762A | ||||
| JP11054677A | ||||
| JP2000150746A |