To provide a semiconductor device, of which the reliability and productivity have been enhanced, by forming a plurality of bonding sections side by side in a width direction of a tape carrier and by adhering a plurality of semiconductor devices, and to provide a manufacturing method thereof.

The manufacturing method for the semiconductor device comprises steps of: taking up a tape carrier 10, which is formed of repetitions of a plurality of bonding sections 14 that are placed in the width direction of the tape carrier, on a reel 24 for provision; providing at least an anisotropic conductive film 30 on the bonding section 14; placing a surface 36 of the semiconductor device 32 that has electrodes 34 on the anisotropic conductive film 30; pressing the semiconductor device 32 toward the bonding section 14 to electrically connect the bonding section 14 and electrode 34; and forming external electrodes 38 on the tape carrier 10; and punching the tape carrier 10 into individual pieces for each semiconductor device 32.

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