Title:
WAFER BREAKING DEVICE
Document Type and Number:
Japanese Patent JPS5877244
Kind Code:
A
Abstract:
PURPOSE:To divide a wafer into pellets by one time action omitting a division in the direction of a scribing line by a method wherein the wafer is pressed to a spherical wall face. CONSTITUTION:An extensible tape 4 adhered with a wafer 10 finished with scribing is put between a bse 2 and a cover 5 as to make the face of the wafer 10 formed with a scribing line 11 to face mutually with a spherical wall 1, and hermetically sealed condition is formed between the upper part of the tape 4 and the cover 5. When the tape is pressed with a pressing part 3 in this condition, the tape 4 extends to press the wafer 10 to the spherical wall 1. When pressing is continued, the wafer 10 pressed in the direction of the spherical wall 1 is divided making the scribing line 11 as the center, and by regulating 7 pressure, the wafer 10 between the spherical wall 1 and the pressing tape 4 expanding in a balloon type is divided up to individual pellets 13 without providing division in the direction of the scribing line. The division in the direction of the scribing line is unnecessary at this device, division can be performed by one action, and structure is simplified extremely.
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Inventors:
ENDOU YUTAKA
Application Number:
JP17604681A
Publication Date:
May 10, 1983
Filing Date:
November 02, 1981
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/301; H01L21/78; (IPC1-7): H01L21/78
Attorney, Agent or Firm:
Uchihara Shin
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