Title:
ウェーハの加工方法
Document Type and Number:
Japanese Patent JP5048379
Kind Code:
B2
Abstract:
A wafer processing method including the step of removing a ringlike reinforcing portion formed along the outer circumference of a wafer on the back side thereof. The ringlike reinforcing portion is ground by a grinding stone in such a manner that the locus of the grinding stone rotating intersects the ringlike reinforcing portion as viewed in plan. The grinding of the ringlike reinforcing portion is ended when the ground surface of the ringlike reinforcing portion becomes higher by 20 to 1 mum than the upper surface of a metal film deposited on the back side of a device area of the wafer. It is unnecessary to accurately align the grinding stone to the ringlike reinforcing portion on the upper side thereof, so that the position control can be easily performed. Further, the grinding of the ringlike reinforcing portion is ended when the difference in height between the ground surface of the ringlike reinforcing portion and the upper surface of the metal film becomes 20 to 1 mum, so that there is no possibility that the metal film may be damaged.
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Inventors:
Karl Priwassa
Application Number:
JP2007099356A
Publication Date:
October 17, 2012
Filing Date:
April 05, 2007
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/304; B24B7/22; H01L21/301
Domestic Patent References:
| JP2007019379A | ||||
| JP2003332271A | ||||
| JP2007019461A | ||||
| JP2007266352A |
Attorney, Agent or Firm:
Isao Sasaki
Kyoko Kawamura
Kyoko Kawamura