PURPOSE: To improve treating capacity for soldering in a single flow wave type soldering device for a printed circuit board by specifying a part of the shape in an outflow passage of a solder well.
CONSTITUTION: A wae type soldering device has a nozzle 22 for gushing upward molten solder 20, a solder well 24 which is connected to the tip thereof and in which solder is temporarily stored, and an outflow passage 26 for solder provided in a part thereof. A part of the outflow passage in such device is formed in a parallel part 26a which is parallel with the advancing line A of a printed circuit board 28. Then the length L at which the solder is in contact with the board 28 is increased. The feed speed is thus increased with the same printed circuit board and since the heat capacity is increased as well, the soldering of the printed circuit board requiring the long contact time with the solder is made possible.
SHIRAI MITSUGI
MURATA YUKIO
SASAKI HIDEAKI
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