Title:
WIRE ELECTRIC DISCHARGE MACHINING APPARATUS, THIN PLATE MANUFACTURING METHOD, AND SEMICONDUCTOR WAFER MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2015168030
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a wire electric discharge machining apparatus, a thin plate manufacturing method, and a semiconductor wafer manufacturing method capable of suppressing reductions in the machining accuracy and machining speed for a workpiece, and increasing yield of worked articles per workpiece.SOLUTION: A wire electrode 12 forms a plurality of cutting wire portions 12a provided in parallel to be spaced apart from one another and opposed to a workpiece 30. Feeders 17a and 18a of feeder units 17 and 18 apply a pulsed machining voltage generated in a machining power supply 16 between the cutting wire portions 12a and the workpiece 30. Each nozzle 19 injects a machining liquid from an injection port so that the machining liquid is directed to clearances between the cutting wire portions 12a and the workpiece 30 along the cutting wire portions 12a. Each wire presser 21 supports the cutting wire portions 12a to be aligned. The nozzle 19 and the wire presser 21 are disposed to be opposite each other across the cutting wire portions 12a.
More Like This:
| JP3237895 | WIRE ELECTRIC DISCHARGE MACHINE |
| WO/1989/009672 | WIRE CUT ELECTRIC DISCHARGE MACHINING METHOD |
Inventors:
MIYAKE HIDETAKA
FUKUSHIMA KAZUHIKO
ITOKAZU ATSUSHI
HASHIMOTO TAKASHI
SEGUCHI MASAKI
FUKUSHIMA KAZUHIKO
ITOKAZU ATSUSHI
HASHIMOTO TAKASHI
SEGUCHI MASAKI
Application Number:
JP2014044675A
Publication Date:
September 28, 2015
Filing Date:
March 07, 2014
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B23H7/02; B23H7/10
Domestic Patent References:
| JPS6029236A | 1985-02-14 | |||
| JPS60104618A | 1985-06-10 |
Foreign References:
| WO2011036924A1 | 2011-03-31 | |||
| WO2012070167A1 | 2012-05-31 |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita
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