Title:
METHOD FOR MANUFACTURING METAL SUBSTRATE
Document Type and Number:
Japanese Patent JP2016126810
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal substrate, capable of peeling a conductive ring from a master disk after electroforming without a trouble even when an uneven pattern exists in a portion having the conductive ring superimposed on the master disk.SOLUTION: A conductive ring 21 consists of a material having conductivity. A master disk 11 has an uneven pattern on the surface. The conductive ring 21 is superimposed through a sticking prevention layer 22 on the surface of the master disk 11 on the side having the uneven pattern. A metal layer 23 is formed on the master disk 11 having the superimposed conductive ring 21 by electroforming. The conductive ring 21 and the metal layer 23 formed by electroforming are peeled from the master disk 11.SELECTED DRAWING: Figure 4
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Inventors:
UMEZAWA TOMOKAZU
MOROOKA ATSUSHI
MOROOKA ATSUSHI
Application Number:
JP2015001272A
Publication Date:
July 11, 2016
Filing Date:
January 07, 2015
Export Citation:
Assignee:
FUJIFILM CORP
International Classes:
G11B5/86; G11B7/26
Domestic Patent References:
| JPH05339776A | 1993-12-21 | |||
| JP2005050513A | 2005-02-24 | |||
| JP2011067950A | 2011-04-07 |
Attorney, Agent or Firm:
Yanagita Seiji
Go Sakuma
Go Sakuma
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