Title:
METHOD AND APPARATUS FOR GRINDING WAFER
Document Type and Number:
WIPO Patent Application WO/2000/025980
Kind Code:
A1
Abstract:
The invention provides a method and an apparatus for dealing with the high manufacturing cost involved in single-wafer grinding and the lack of flatness involved in batch-grinding. According to the method and apparatus, wafers (W) held on a wafer holder (12) are pressed against a buff (14) attached to a surface plate (20) with a predetermined load applied by a weight (70), and the wafer are ground on one side. The wafer holder consists of a plurality of wafer supports (12a) for holding wafers and a connection board (12b) for connecting the wafer supports integrally. The wafer supports have high stiffness while the connection board has low stiffness. Means (74) is also provided for distributing grinding load equally to the wafer supports.
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Inventors:
TANAKA KOUICHI (JP)
Application Number:
PCT/JP1999/005811
Publication Date:
May 11, 2000
Filing Date:
October 21, 1999
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
TANAKA KOUICHI (JP)
TANAKA KOUICHI (JP)
International Classes:
B24B37/30; H01L21/304; (IPC1-7): B24B37/04; H01L21/304
Foreign References:
| EP0362811A2 | 1990-04-11 | |||
| JPS5442473U | 1979-03-22 | |||
| JPS5048592A | 1975-04-30 | |||
| JPH0615563A | 1994-01-25 | |||
| JPH10100064A | 1998-04-21 |
Other References:
See also references of EP 1080842A4
Attorney, Agent or Firm:
Ishihara, Shoji (Wakai Building 7-8, Higashi-Ikebukuro 3-chome Toshima-ku Tokyo, JP)
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