Title:
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING STRUCTURE OF MULTILAYER CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2024/029149
Kind Code:
A1
Abstract:
Provided is a multilayer ceramic electronic component capable of suppressing deterioration in insulation resistance due to hydrogen. In a multilayer ceramic electronic component according to the present invention, a first external electrode 30a has: a first base electrode layer 32a; a first lower plating layer 34a1 disposed on the first base electrode layer 32a; and a first upper plating layer 34a2 that is disposed on the first lower plating layer 34a1 excluding a first plating exposed region 35a, such that the first lower plating layer 34a1 has the first plating exposed region 35a exposed to a surface of the first external electrode 30a. A second external electrode 30b has: a second base electrode layer 32b; a second lower plating layer 34b1 disposed on the second base electrode layer 32b; and a second upper plating layer 34b2 that is disposed on the second lower plating layer 34b1 excluding a second plating exposed region 35b, such that the second lower plating layer 34b1 has the second plating exposed region 35b exposed to a surface of the second external electrode 30b.
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Inventors:
FUJIWARA KENTAROU (JP)
YASUDA TATSUNORI (JP)
YASUDA TATSUNORI (JP)
Application Number:
PCT/JP2023/017199
Publication Date:
February 08, 2024
Filing Date:
May 02, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/30
Foreign References:
| JP2019186412A | 2019-10-24 | |||
| JP2020167236A | 2020-10-08 | |||
| JP2013110239A | 2013-06-06 |
Attorney, Agent or Firm:
OKADA, Masahiro (JP)
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