Title:
RESIST COMPOSITION AND RESIST FILM FORMING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2023/008354
Kind Code:
A1
Abstract:
The present invention provides a resist composition which contains a resin (A) and a solvent (B) containing a compound (B1) represented by general formula (b-1), and which contains an active ingredient in an amount of 45 mass% or less with respect to the total amount of the resist composition. [In formula (b-1), R1 represents an alkyl group having 1-10 carbon atoms.]
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Inventors:
OKADA TAKUMI (JP)
HOSHINO RYOSUKE (JP)
SATO HIDEYUKI (JP)
KATAGIRI MASAYUKI (JP)
SUZUKI SHU (JP)
ECHIGO MASATOSHI (JP)
HOSHINO RYOSUKE (JP)
SATO HIDEYUKI (JP)
KATAGIRI MASAYUKI (JP)
SUZUKI SHU (JP)
ECHIGO MASATOSHI (JP)
Application Number:
PCT/JP2022/028576
Publication Date:
February 02, 2023
Filing Date:
July 25, 2022
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C07C39/19; C07C69/54; C07C69/675; C07C69/708; C07C309/06; C07C381/12; C08F20/10; C08F220/28; G03F7/004; G03F7/023; G03F7/039; G03F7/20
Domestic Patent References:
| WO2020054449A1 | 2020-03-19 | |||
| WO2021172132A1 | 2021-09-02 |
Foreign References:
| JPH07281425A | 1995-10-27 | |||
| JP2011502276A | 2011-01-20 | |||
| JPS62123444A | 1987-06-04 | |||
| JPH07301917A | 1995-11-14 | |||
| JPH11109633A | 1999-04-23 | |||
| JP2019119851A | 2019-07-22 | |||
| JP2000335127A | 2000-12-05 |
Attorney, Agent or Firm:
KOBAYASHI Hiroshi et al. (JP)
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