Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/032534
Kind Code:
A1
Abstract:
A package-on-package (PP) comprises semiconductor packages (SP1-SP3) and a coil (CO) provided on the semiconductor packages (SP1-SP3). The semiconductor package (SP3) has a lower surface (LS) and a solder ball (SB3) projecting from the lower surface (LS). The axis (AX) of the coil (CO) is inclined to the normal line (NL) of the lower surface (LS).
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Inventors:
TADA AKIRA (JP)
TANABE HIROKI (JP)
OKADA YOSHINORI (JP)
KUDO IKUO (JP)
TANABE HIROKI (JP)
OKADA YOSHINORI (JP)
KUDO IKUO (JP)
Application Number:
PCT/JP2009/062099
Publication Date:
March 25, 2010
Filing Date:
July 02, 2009
Export Citation:
Assignee:
RENESAS TECH CORP (JP)
TADA AKIRA (JP)
TANABE HIROKI (JP)
OKADA YOSHINORI (JP)
KUDO IKUO (JP)
TADA AKIRA (JP)
TANABE HIROKI (JP)
OKADA YOSHINORI (JP)
KUDO IKUO (JP)
International Classes:
H01L25/00; H01L25/10; H01L25/11; H01L25/18
Foreign References:
| JP2008004612A | 2008-01-10 | |||
| JP2008135430A | 2008-06-12 | |||
| JP2005259969A | 2005-09-22 | |||
| JP2000124406A | 2000-04-28 | |||
| JP2006066454A | 2006-03-09 | |||
| JP2005229766A | 2005-08-25 |
Attorney, Agent or Firm:
FUKAMI, Hisao et al. (JP)
Hisao Fukami (JP)
Hisao Fukami (JP)
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