Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2022/079759
Kind Code:
A1
Abstract:
This semiconductor module is provided with: a base plate (50) which is in the form of a plate; a terminal member (80); an electronic component which is bonded to one surface of the base plate (50); and a molding resin (70) which seals the base plate (50), the terminal member (80) and the electronic component. The base plate (50) and the terminal member (80) are conductive members that are arranged on a same plane at a distance from each other; each of the base plate (50) and the terminal member (80) has a main body part and a terminal part that is exposed to the outside from the molding resin (70). The main body part (52) of the base plate (50) is provided with a through hole (60) in an extended portion (53) that extends toward the terminal part (51) and is connected to the terminal part (51).
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Inventors:
TAKEUCHI KENSUKE (JP)
Application Number:
PCT/JP2020/038472
Publication Date:
April 21, 2022
Filing Date:
October 12, 2020
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/29; H01L23/48; H01L25/07; H01L25/18
Domestic Patent References:
| WO2017179394A1 | 2017-10-19 | |||
| WO2015001648A1 | 2015-01-08 | |||
| WO2019216159A1 | 2019-11-14 |
Foreign References:
| JP2006253734A | 2006-09-21 | |||
| JP2003324176A | 2003-11-14 |
Other References:
See also references of EP 4227987A4
Attorney, Agent or Firm:
PALMO PATENT FIRM, P.C. (JP)
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