Title:
SENSOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/210064
Kind Code:
A1
Abstract:
Provided is a sensor device in which miniaturization of SPAD pixels is enabled. The sensor device comprises a first substrate part and a second substrate part bonded to the first substrate part. The first substrate part comprises a first semiconductor substrate and a pixel region provided to the first semiconductor substrate and in which SPAD pixels and a plurality of visible light pixels are mixed in an array shape. The second substrate part comprises: a second semiconductor substrate opposing the first semiconductor substrate; an SPAD circuit provided on the second semiconductor substrate and connected to the SPAD pixels; and a visible light pixel circuit provided on the second semiconductor substrate and connected to the plurality of visible light pixels.
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Inventors:
TSUGAWA HIDENOBU (JP)
KAJIKAWA RYOKO (JP)
KAJIKAWA RYOKO (JP)
Application Number:
PCT/JP2022/012946
Publication Date:
October 06, 2022
Filing Date:
March 22, 2022
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H04N5/3745; H01L27/146
Domestic Patent References:
| WO2020036025A1 | 2020-02-20 | |||
| WO2020203222A1 | 2020-10-08 |
Foreign References:
| US20160240579A1 | 2016-08-18 | |||
| JP2020008412A | 2020-01-16 | |||
| JP2019176335A | 2019-10-10 | |||
| JP2020096225A | 2020-06-18 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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