Title:
THERMOELECTRIC CONVERSION BODY, THERMOELECTRIC CONVERSION MODULE, AND METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION BODY
Document Type and Number:
WIPO Patent Application WO/2021/124860
Kind Code:
A1
Abstract:
Provided are: a thermoelectric conversion body that has high electrical conductivity, can exhibit high thermoelectric conversion efficiency when used in a thermoelectric conversion module, and is less susceptible to warpage during manufacture; a method for manufacturing the same; and a thermoelectric conversion module using the same. A thermoelectric conversion body that is a sintered body of a composition including a thermoelectric semiconductor material and a heat-resistant resin, wherein if the weight of the heat-resistant resin at 400°C during a temperature increase is considered to be 100%, the temperature at which the weight decreases by 5% is 480°C or below; a thermoelectric conversion module including the thermoelectric conversion body; and a method for manufacturing the thermoelectric conversion body.
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Inventors:
SEKI YUTA (JP)
KATO KUNIHISA (JP)
MUTO TSUYOSHI (JP)
KATO KUNIHISA (JP)
MUTO TSUYOSHI (JP)
Application Number:
PCT/JP2020/044581
Publication Date:
June 24, 2021
Filing Date:
December 01, 2020
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L35/24; H01L35/34
Foreign References:
| JP2019179911A | 2019-10-17 | |||
| JP2005114077A | 2005-04-28 | |||
| JP2018059230A | 2018-04-12 | |||
| JP2007207873A | 2007-08-16 | |||
| JP2006069160A | 2006-03-16 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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