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WO/2023/068164A1 |
Problem: To provide a method for manufacturing a sliding member, a method for manufacturing a damper, a sliding member, a damper, and a method for adjusting ride comfort that improve retention of lubricant oil between sliding members whi...
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WO/2023/066310A1 |
Disclosed are a device and method for rail web rust removal before steel rail welding. The device comprises a rust removal power apparatus and a grinding and rust removal apparatus; the grinding and rust removal apparatus comprises a rus...
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WO/2023/066179A1 |
A deburring mechanism and a deburring assembly. The deburring mechanism comprises a frame (1), a first deburring set (21) and a second deburring set (22). The frame (1) has a first side plate (11) and a second side plate (12), and the fi...
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WO/2023/069623A1 |
An abrasive backing is generally provided. In some embodiments, the abrasive backing includes a base sheet, comprising wood fibers, synthetic fibers, cellulose filaments, a saturant, wherein the saturant includes two or more latex polyme...
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WO/2023/066824A1 |
Disclosed is a retainer (10) for processing optical workpieces each having two workpiece surfaces and a workpiece rim therebetween. The retainer comprises a holding assembly (72) and a support assembly (73) for the workpiece. A rubber-el...
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WO/2023/068124A1 |
The present invention relates to a substrate processing apparatus for processing a substrate such as a wafer, in particular to a substrate processing apparatus that presses a processing tool against a surface of the substrate while holdi...
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WO/2023/063536A1 |
The present invention relates to: an exterior panel for home appliances, having excellent reflectivity and durability and being applicable to the exterior of various home appliances; a home appliance comprising the exterior panel; and an...
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WO/2023/060403A1 |
A method and an electronic device for controlling a robotic system. The method comprises obtaining scanned data about a first junction and a second junction for welding a body frame and a roof of a bus (410), the first and second junctio...
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WO/2023/063166A1 |
Provided is a grinding device whereby the position of a workpiece surface to be processed can be efficiently and precisely measured without advance preparation such as NC program creation. The present invention has a workpiece table (1...
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WO/2023/064674A1 |
A grinding bit is provided. The grinding bit includes a shank having a central axis and a cutting body. The shank further includes a first shank end and a second shank end opposite to the first shank end. The first shank end is configure...
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WO/2023/063213A1 |
[Problem] For the purpose of eliminating bumps in the peripheries of laser marks in a wafer polishing process, the present invention provides: a polishing composition that provides a flat polished surface; and a method for polishing a wa...
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WO/2023/062334A1 |
There is provided a method of making a drill bit (10: 20) comprising a base portion (12:22) and a cutting portion (14: 24), the method comprising providing the base portion (12: 22) and the cutting portion (14: 24) as separate pieces, he...
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WO/2023/062866A1 |
This cutting device is configured to cut an object to be cut, with a blade. The cutting device comprises an imaging unit, and a control unit. The imaging unit is configured to move relatively to a dressing board, and image some region of...
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WO/2023/062973A1 |
In a processing machine 1, a Z-axis electric motor 39 moves a main shaft 37 in a Z direction. A Z-axis position sensor 69 detects a position of the main shaft 37 in the Z direction. A rotation sensor 71 detects rotation of the main shaft...
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WO/2023/061140A1 |
A sanding machine, comprising an airflow element (11), a motor (51), and a battery pack. The airflow element (11) can rotate around a central axis (102) along a preset rotation direction to generate a chip removal airflow; the motor (51)...
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WO/2023/061510A1 |
A grinding method, being used for grinding at least one intersecting line in a valve cavity. The grinding method comprises: obtaining coordinates of M first sampling points on one intersecting line in the at least one intersecting line; ...
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WO/2023/058285A1 |
An information processing device (5) comprises: an information acquisition part (500) for acquiring crack generation state information that includes crack state information indicating a crack state at a time when crack has been generated...
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WO/2023/057838A1 |
A surface conditioning article comprises: a fabric backing having first and second opposed major sides; a lofty open nonwoven fiber web comprising entangled fibers disposed on and secured to the first major side of the fabric backing; an...
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WO/2023/058852A1 |
According to one embodiment, an electronic device housing comprises a metal frame, wherein the surface of the metal frame has a gloss value of 1 to 10 gloss unit (Gu), the maximum height in a plurality of uneven parts arranged on the sur...
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WO/2023/056704A1 |
An electric cleaning apparatus, in particular a cleaning disc for such an electric cleaning apparatus, which aims to solve the problems in the prior art of uneven water output of a cleaning disc of a cleaning apparatus and a small water ...
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WO/2023/058107A1 |
A machining device (1, 201) for machining a workpiece (W), which is supported by a workpiece supporting member (20, 30, 40, 60, 220, 230, 240), with a tool (T, T2), the machining device (1, 201) comprising a processing unit (3, 203) that...
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WO/2023/059999A1 |
The present invention discloses Shallow Trench Isolation (STI) Chemical Mechanical Planarization (CMP) polishing compositions, methods and systems that offer high and tunable Oxide: SiN and Oxide: Poly-Si removal selectivity, and low oxi...
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WO/2023/058751A1 |
The present invention reliably suctions a substrate regardless of the flatness of a surface to be suctioned of the substrate. A substrate suction member 330 includes: a porous member 334 having a substrate suction surface 334a for suct...
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WO/2023/056324A1 |
Synthesis of triazole- and/or triazolium-based polymers is disclosed. Chemical Mechanical Planarization (CMP) slurries comprise abrasives; activator; oxidizing agent; additive comprising triazole- and/or triazolium-based polymers; and wa...
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WO/2023/054386A1 |
Provided is a polishing composition that makes it possible to achieve an excellent polishing removal speed with respect to a polished object while improving the surface quality of a polished surface after polishing. The polishing composi...
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WO/2023/050451A1 |
A base (25) for a sheet sander (10) including a baseplate (30) and a guide (60, 65). The baseplate (30) has an upper side and a lower side opposite the upper side, and the upper side defines a guide mount (40, 45). The guide (60, 65) is ...
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WO/2023/054385A1 |
The purpose of the present invention is to provide a polishing composition which can achieve an excellent polishing/removal rate for an object of interest. Provided is a polishing composition which is intended to be used for the polishin...
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WO/2023/052918A1 |
An apparatus (100) for removing an abrasive element (20) having a perimeter edge (26) delimiting an abrasive surface (22) in a machine (1) for finishing surfaces comprising a support body (10) for removably engaging the abrasive element ...
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WO/2023/056432A1 |
An abrasive article with a bonded abrasive body having a ratio of diameter to thickness of at least 10:1. The abrasive article can include secondary abrasive particles contained in a bond material, wherein the secondary abrasive particle...
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WO/2023/053476A1 |
The purpose of the present invention is to provide a method and apparatus for producing a semiconductor crystal wafer, the method and apparatus being capable of easily and reliably producing a semiconductor crystal wafer of high quality....
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WO/2023/053105A1 |
A pipe coating material removal apparatus, comprising a support frame, a subframe, and one or more coating material removal members. The subframe is supported by the support frame and is configured to rotate relative to the support frame...
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WO/2023/054331A1 |
Provided is a thermoplastic polyurethane for a polishing layer in which the D hardness in a sheet with a thickness of 2 mm after saturating the sheet with water at a temperature of 50ºC and causing the sheet to swell is less than 50, an...
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WO/2023/052421A1 |
The present invention relates to a method for grinding an elongate workpiece (14), comprising the following steps: - clamping the workpiece (14), wherein the workpiece (14) is supported at a first workpiece end (82) in a first workpiece ...
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WO/2023/055070A1 |
The present invention provides a Zn-Mg-Al-based plated steel sheet excellent in corrosion resistance and excellent in at least one of weldability and phosphatability, and a manufacturing method therefor.
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WO/2023/055663A1 |
A chemical mechanical planarization (CMP) pad conditioner assembly includes a backing plate including at least one polymer and at least one additive. The at least one additive is present in an amount sufficient to result in a backing pla...
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WO/2023/055649A1 |
A CMP pad conditioner assembly includes a backing plate including a first face including a plurality of first mounting locations and a second face including a plurality of second mounting locations. A plurality of segments is secured to ...
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WO/2023/054562A1 |
A polishing device (10) comprises: a wafer-holding part (31) that holds a wafer (W) and brings the held wafer (W) into contact with a polishing surface (22a); a surface plate drive unit (24) or a head drive unit (34) that rotates the waf...
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WO/2023/055274A1 |
A method and a device for induced formation of solid lubricant comprises providing (S10) of an article (10) to be processed. The article is exposed (S20) to a process fluid (34) comprising a solvent, impact media (20) and additives of so...
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WO/2023/051960A1 |
The invention relates to a machine for machining sheet metal parts, comprising a brush unit (70) having at least one horizontally rotating polishing brush (71) for brushing the surface of the sheet metal parts to be machined. In order to...
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WO/2023/049317A1 |
The invention provides a chemical-mechanical polishing composition comprising: (a) about 3.0 wt.% to about 10 wt.% silica abrasive; (b) an anionic polymer having a weight average molecular weight of about 400 kDa to about 7000 kDa; and (...
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WO/2023/046937A1 |
A method for machining optical workpieces, in which a semifinished product (HZ) having predetermined surface geometries on the front side (FS) and rear side (RS) and a contoured edge (RA) of predetermined edge thickness (D2) therebetween...
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WO/2023/048700A1 |
Apparatus (100, 600, 700, 1000) and method (500, 1200) for sharpening a cutting edge (20, 412, 446, 456, 466, 476, 1080A, 1100 A) of a cutting tool (10, 390, 400, 440, 450, 460, 470A, 470B, 470C, 626, 726, 820, 1050, 1070), such as a kit...
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WO/2023/047640A1 |
A method for manufacturing a chamfering wheel includes: forming concentrically, by coaxial machining, a reference surface that is one of a pair of side surfaces of a disc, a fitting hole through which a rotary shaft part is fitted in the...
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WO/2023/048266A1 |
Provided is a polishing pad comprising a polishing layer that is a molded article of a polyurethane composition. The polyurethane composition contains 90-99.9 mass% of a thermoplastic polyurethane containing a non-alicyclic diisocyanate ...
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WO/2023/049214A1 |
A buffing pad assembly having a buffing pad, an attachment means, and an insert (e.g., plastic ring) is provided. In one embodiment, a channel is cut into a side of the buffing pad, creating first and second side portions. The attachment...
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WO/2023/047682A1 |
The present invention relates to a polishing device, a substrate processing apparatus, and a polishing method. This polishing device comprises a polishing unit 22. The polishing unit 22 comprises: a holding and rotating unit 35 that rota...
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WO/2023/047683A1 |
The present invention relates to a polishing method, and a substrate processing apparatus. This polishing method comprises: a rotation step for rotating a substrate W in a horizontal posture; an etching step for supplying an etching liqu...
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WO/2023/047817A1 |
Provided is a highly durable magnet separator that is unlikely to be affected by foreign matter in a liquid. The magnet separator comprises a separator main body, a magnet drum, and a drive unit. The magnet drum has: a first shaft that...
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WO/2023/047437A1 |
In a processing device (2, 302) for processing a workpiece (W) with a tool (T, T2), a processing estimation device (3, 5, 303) estimates at least one among the condition of the workpiece (W) or the tool (T, T2), the shape of the workpiec...
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WO/2023/047731A1 |
Provided is a simple method for manufacturing an adhesive-layer-attached optical laminate that prevents floating of a release liner. A method for manufacturing an adhesive-layer-attached optical laminate according to an embodiment of the...
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