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WO/2023/113255A1 |
The present invention provides a double-sided adhesive tape for adhering a polishing pad, and a chemical-mechanical polishing apparatus using the adhesive tape, the adhesive tape comprising: an upper release film layer; a first adhesive ...
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WO/2023/110294A1 |
The invention relates to a method for recycling electrode material from used batteries or from discard material from battery production, and specifically for detaching and recovering active electrode material (4) from anodic or cathodic ...
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WO/2023/110939A1 |
The invention relates to a method for producing spectacles lenses (10), in which method, starting with a blank, via a semifinished product, a finished product, which has predetermined surface geometries on a front face (12) and a rear fa...
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WO/2023/114196A1 |
The present invention relates to a method of finalizing a 3D printed dental prosthesis by subjecting the dental prosthesis to a pressurized water stream comprising glass beads. Also disclosed is a 3D printed dental prosthesis or componen...
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WO/2023/112490A1 |
The present invention is a workpiece cutting method using a wire saw, said method including: a step for cutting a first cylindrical workpiece by using a fixed abrasive grain wire; after completion of the step for cutting the first cylind...
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WO/2023/114068A1 |
An optical fiber polisher includes a polishing mechanism, a platen, and a memory for storing operational parameters entered by a user. The optical fiber polisher includes a processor to control a stopping position of the platen at an end...
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WO/2023/109579A1 |
The present invention relates to the field of grinding and polishing, and provides a paint surface reciprocating grinding and polishing abrasive paper system. The paint surface reciprocating grinding and polishing abrasive paper system s...
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WO/2023/112680A1 |
This substrate processing device comprises: a substrate holding portion (5) with a suction holding face (5a) for holding a first face (2a) of a substrate (W); a processing head (7) arranged to process an outer peripheral portion of the s...
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WO/2023/111831A1 |
Machine (1) for smoothing and/or polishing articles, preferably in slab form, by using predetermined operating conditions, comprising a plurality of spindles (6) mounted on a machining station (4) and having one or more abrasive tools (8...
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WO/2023/110414A1 |
The invention relates to treatment of a thread cutting tap (1) comprising a thread cutting portion (2) including a plurality of cutting lands (3) separated by flutes (4), wherein the thread cutting portion (2) comprises a chamfered secti...
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WO/2023/112464A1 |
This cutting device comprises a table, a cutting mechanism, a holding mechanism, and a water isolation/discharge mechanism. The table or the holding mechanism is connected to a dry vacuum pump through a suction path. The water isolation/...
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WO/2023/111529A1 |
A machine tool (30) for machining two workpieces (48, 50) comprises a machine base (32), a first tool mount (37), first and second workpiece mounts (44, 46) with respective drives (69, 71), and a controller (72) arranged to control the f...
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WO/2023/106358A1 |
The present disclosure relates to chemical-mechanical polishing (CMP) compositions for polishing polycrystalline silicon carbide-containing surfaces. More particularly, the polishing compositions are in the form of a slurry with a pH of ...
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WO/2023/106905A1 |
The present invention relates to machining devices, especially to the devices for grinding, polishing and cleaning tube like members. A machining device (1) comprises a support (2) with a motor; a split support disc (10) fixed to the sup...
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WO/2023/105633A1 |
[Problem] To appropriately perform setting of a dressing timing that has repeatability, effectively using experience and knowledge of a skilled expert regarding dressing timings for grinding wheels. [Solution] The problem is addressed by...
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WO/2023/105355A1 |
A robotic abrading system that includes a robotic tool coupled to a robotic arm. The robotic arm is configured to move the robotic tool into an abrading position with respect to a workpiece. The system also includes a backup pad coupled ...
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WO/2023/106016A1 |
Provided is a wafer manufacturing method for obtaining a wafer from an ingot (2) having a c-axis provided in a state in which a center axis (L) is tilted in an off-angle direction (Dθ) by an off-angle greater than 0 degree, the method c...
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WO/2023/107325A1 |
A carrier assembly for holding a hose that includes a main body having a first portion movingly engaged with a second portion. There is a first guide rail disposed on at least one of the first portion and the second portion. Either the f...
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WO/2023/106292A1 |
This coolant device can efficiently separate sludge-like fine chips from a coolant, and does not use a filter that becomes waste. The chips in the coolant passed through a first vessel 202A and a second vessel 202B are attracted to a p...
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WO/2023/103242A1 |
A plate polishing method, wherein a multi-section intelligent swing polishing machine is used for polishing; the multi-section intelligent polishing machine comprises a rack (1); a conveying device (2) and a plurality of fixed supports (...
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WO/2023/104041A1 |
Provided are a material and a preparation method therefor, an application of the material, and an abrasive material. The material comprises a polymer substrate and foamed microspheres distributed in the polymer substrate, wherein the foa...
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WO/2023/106517A1 |
An embodiment of the present invention provides a device for measuring a wafer polishing amount, comprising: a first weighing unit for measuring the weight of a loading cassette in which wafers are accommodated before polishing; a second...
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WO/2023/106047A1 |
A steel plate manufacturing method according to the present invention includes: a temperature measurement step in which the surface temperature of a steel plate is measured over the entire width and the entire length of at least one of a...
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WO/2023/104586A1 |
The present disclosure relates to a floor grinding machine (1) comprising an electric motor (2) which extends along an axis of rotation (x) and which is interconnected to a grinding unit (3). The grinding unit (3) comprises a housing (4)...
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WO/2023/102887A1 |
Described herein are examples of material removal machines with work tables separated by an air gap. In some examples, the air gap may provide space for a material removal tool of the material removal machine to extend between and substa...
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WO/2023/099577A1 |
The invention relates to a system (1) for blocking an ophthalmic lens (2) with an insert (3), said system comprising: - a cover (10) forming a chamber, filled with a gas, in which the ophthalmic lens and the insert are bonded by a glue (...
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WO/2023/100279A1 |
An objective of the present disclosure is to provide an optical multiplexing/demultiplexing circuit manufacturing device and an optical multiplexing/demultiplexing circuit manufacturing method, wherein a part of a side surface of an opti...
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WO/2023/099854A1 |
The present invention relates to a method of manufacture (S) of an optical surface (4) of an optical part (1), comprising the following steps: obtaining (S1) an optical part (1) comprising a substrate (3) made of a first aluminium alloy ...
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WO/2023/100100A1 |
Cutting method of a layer (S) of ceramic powder material having a modulus of rupture that is smaller than about 10 N/mm2, comprising: a step of moving the layer (S) of ceramic powder material along a given path (P) in a moving direction ...
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WO/2023/100634A1 |
A metal-bonded grinding wheel comprising an abrasive grain layer in which a plurality of abrasive grains and a plurality of pores are dispersed in a metal bonding material. The porosity of the plurality of pores in the abrasive grain lay...
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WO/2023/100744A1 |
The present invention pertains to a method which is for manufacturing a glass substrate and which involves: fixing, to the surface of a pedestal, at least a part of a glass plate provided with a main face having a curved surface that has...
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WO/2023/102007A1 |
An abrasive article mounting assembly is presented. The abrasive article mounting assembly includes a backup pad. The assembly also includes a tool engaging aperture that receives a shaft of a tool. The assembly also includes a backup pa...
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WO/2023/097488A1 |
A device for polishing a wafer, the device comprising: a fixing device (110) for fixing a wafer (140). A polishing platform comprises n polishing assemblies (130), a first plane of each polishing assembly comprising a polishing region (1...
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WO/2023/099083A1 |
The invention relates to a tool interface device, in particular an insertion tool hub, for an insertion tool for connecting the insertion tool to a tool holder of a machine tool, in particular a portable machine tool, which tool interfac...
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WO/2023/099084A1 |
The invention relates to a tool-receiving device for a portable machine tool, in particular for an angle grinder, comprising at least one output unit (14a; 14b; 14c) with at least one output spindle (16a; 16b; 16c) which can be rotated; ...
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WO/2023/098342A1 |
Provided in the present application are a grinding mechanism and a grinding robot, which relate to the technical field of robot building. The grinding mechanism comprises: a base; a spline nut mounted on the base; a spline shaft arranged...
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WO/2023/100957A1 |
Provided is a glass sheet manufacturing method comprising: a grinding step P1 for processing an end face 1a of a glass sheet 1 with a grinding wheel 2; and a polishing step P2 for processing the end face 1a of the glass sheet 1 with a po...
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WO/2023/101842A1 |
A fixture is provided for converting a distance-controlled milling machine to a pressure-controlled regime, suitable for localized polishing. Methods of performing localized polishing utilizing the fixtures are also provided.
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WO/2023/100104A1 |
Abrasive articles include a circular center member having an outer edge, a radial line, and a radial plane, a plurality of bristles extending outward from the outer edge of the circular center member and having a projection on the radial...
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WO/2023/101169A1 |
The present invention relates to a grinder blade fixing device used to easily attach or detach a grinder blade such as a cutting stone, a grinding stone, a brush, or the like to or from a hand grinder side. The present invention provides...
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WO/2023/099085A1 |
The invention relates to a tool holding device (10a; 10b) for positioning at least one tool means (400a; 400b), in particular at least one tool disc, on a portable machine tool (500a; 500b), in particular on an angle grinder, said tool h...
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WO/2023/095607A1 |
A substrate polishing device comprising an optical sensor for detecting the state of a substrate surface, wherein the accuracy of detection by the optical sensor is improved. Proposed is a polishing pad for a substrate polishing device...
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WO/2023/094721A1 |
This specification relates to a solution for overcoming the problem of loose loops formed by cutting the abrasive products. A method of obtaining an abrasive product (100) is provided. The method comprises providing a substrate (101, 201...
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WO/2023/097281A1 |
A grinder including a housing, a motor within the housing, and a first handle attached to the housing and including a first sensor configured to detect the presence of a user. The grinder includes a second handle attached to a pivot arm,...
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WO/2023/096544A1 |
An inspection tool (100) for inspection of a concrete surface (180), the tool comprising a vision-based sensor (110) arranged to be directed at a section of the concrete surface (180), guiding means (120) for allowing an operator (170) t...
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WO/2023/095986A1 |
The present invention relates to an apparatus for non-contact cutting a pile by using a waterjet and, more specifically, to a pile-cutting apparatus for cutting a pile after entering inside the pile, the apparatus comprising: a body whic...
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WO/2023/093594A1 |
A floor polishing robot trajectory deviation correction method and apparatus having an error correction function, relating to the technical field of robot control. The method comprises: obtaining the pose of a robot in real time by means...
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WO/2023/095503A1 |
The present invention relates to a wafer-supporting template assembly used for polishing one surface of a wafer, the template assembly being provided with: a back pad; and a guide ring part fixed along the outer peripheral part of the ba...
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WO/2023/095871A1 |
An alumina powder satisfying the following relationship (1). Relationship (1): Rsp/(total surface area of alumina powder)≤12.0 Rsp and the total surface area of alumina powder in relationship (1) are obtained respectively using the fol...
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WO/2023/092615A1 |
The present invention provides a grinding and polishing integrated machine tool in the technical field of machining, comprising: a machine tool body; and a clamping assembly which clamps both ends of a workpiece and drives the workpiece ...
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