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WO/2023/131075A1 |
Disclosed in the present invention is a polishing pad finishing apparatus, comprising: a connecting arm that horizontally extends; a finishing head unit, provided at one end of the connecting arm and used for finishing a polishing pad; a...
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WO/2023/132696A1 |
A management server for supporting remote control of a lens edger through a user terminal, according to embodiments of the present invention, comprises: a communication system which performs remote control of the lens edger using the use...
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WO/2023/133196A2 |
An adaptable belt sander may comprise: a tool holder; a housing; a drive system comprising a first gear and a second gear configured to engage the first gear, the second gear coupled to a shaft; and a belt system comprising a belt extend...
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WO/2023/131378A1 |
The invention relates to particulate treatment articles for treating surfaces of products, particularly 3D-printed products, particularly for smoothing and/or cleaning, particularly by way of a blast method, wherein the particulate treat...
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WO/2023/133110A1 |
Apparatus and methods for correcting asymmetry in a thickness profile by use of a Chemical Mechanical Planarization (CMP) process. In one embodiment a CMP system includes a polishing pad, an adhesion layer, and a platen. The polishing pa...
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WO/2023/132165A1 |
Provided is a novel dresser capable of imparting high flatness to a polishing pad. A dresser for a surface of a polishing pad is provided, comprising a circular dressing surface having a diameter DCD and facing the pad surface, and pel...
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WO/2023/123602A1 |
Disclosed is a rotary wafer exchange system; the rotary wafer exchange system comprises a tray assembly and at least one wafer exchange apparatus; said tray assembly comprises a rotary shaft and at least two trays used for holding wafers...
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WO/2023/129567A1 |
. Pad conditioning brushes are described. In particular, pad conditioning brushes including a carrier layer and a plurality of abrasive particle-free brush bristles extending from the carrier layer are described. The carrier layer and th...
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WO/2023/130051A1 |
An abrasive article including a backing; a plurality of shaped abrasive particles overlying the backing; where the abrasive article further has: 1) a Swarf Mode Gray Value of less than 25 for cumulative material removed of at least 500 g...
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WO/2023/126760A1 |
Pad conditioning disks are described. In particular, pad conditioning disks includes discrete abrasive elements and a circumferential compressible layer are described. When uncompressed, the maximum height of the circumferential compress...
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WO/2023/127155A1 |
This numerical control device comprises: a calculation unit that calculates, from a machining program, a start point and an end point of a reciprocating movement of a feed shaft; a control unit that synchronous controls, between the star...
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WO/2023/129779A1 |
A cutting element includes a substrate and a volume of polycrystalline diamond (PDC) on the substrate. The PDC volume has a front cutting face, a lateral side surface, and a cutting edge between the front cutting face and the lateral sid...
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WO/2023/125916A1 |
Disclosed in the present invention is a wafer polishing system, comprising polishing units. Each polishing unit comprises a wafer transfer channel and a polishing module; the polishing module comprises a polishing platform and a polishin...
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WO/2023/126854A1 |
Polishing pads include a polishing layer having a thickness and including a polymer having a working surface and a second surface opposite the working surface are described. In particular, polishing pads where the working surface include...
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WO/2023/130059A1 |
A method for forming an abrasive article via an additive manufacturing technique including forming a layer of powder material comprising a precursor bond material and abrasive particles, compacting at least a portion of the layer to form...
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WO/2023/127279A1 |
Provided is a filter member having a filter that exhibits a long filter life and that can maintain a particle concentration in a particle-containing liquid being filtered. The filter member has a filter that has an opening diameter that ...
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WO/2023/130052A1 |
An abrasive article including: a backing layer including a front fill overlying a backing, wherein the backing layer including the front fill comprises (1) a surface roughness of not greater than 100 microns or (2) an average thickness/r...
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WO/2023/130053A1 |
An abrasive article includes a backing; a make coat overlying the backing; and a plurality of abrasive particles overlying the backing and at least partially contained in the make coat; and a make coat thickness ratio (Tg/Ta) of not grea...
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WO/2023/130082A1 |
A method for forming an abrasive article via an additive manufacturing technique including forming a layer of powder material comprising a precursor bond material and abrasive particles, compacting at least a portion of the layer to form...
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WO/2023/130088A1 |
A method for forming an abrasive article via an additive manufacturing technique including forming a layer of powder material comprising a precursor bond material and abrasive particles, compacting at least a portion of the layer to form...
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WO/2023/126761A1 |
A conditioning disk with microfeatures is described. More specifically, a conditioning disk with at least one discrete abrasive element and at least one microfeature. The asymmetry of the at least one microstructure may enable, based on ...
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WO/2023/126271A1 |
The invention relates to a grinding means, in particular a grinding disc, for grinding a workpiece, having an, in particular flexible, support element (13), having a plurality of grinding elements (15) for grinding a workpiece, and havin...
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WO/2023/127601A1 |
The present invention predicts the occurrence of a waviness anomaly. This waviness prediction device comprises: a data input unit for receiving input of waviness data which is obtained by measuring the waviness of a polishing target surf...
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WO/2023/130015A1 |
An abrasive article can include a core and an abrasive component attached to the core. The abrasive component may include a body including a leading end and a trailing end, wherein the leading end has a width greater than a width of the ...
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WO/2023/123603A1 |
Disclosed in the present invention is a wafer post-processing device, comprising a driving mechanism, which vertically clamps a wafer and drives same to rotate; a supply arm, which swings on a side face of the wafer and supplies liquid t...
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WO/2023/123207A1 |
The present invention aims to provide a process method for improving the surface smoothness of a combustion turbine blade profile surface, and is capable of improving the smoothness of a blade profile surface without destroying traces fo...
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WO/2023/127898A1 |
In one embodiment, provided is a polishing liquid composition for a silicon oxide film, the polishing liquid composition being capable of improving the smoothness of a polished substrate surface while maintaining polishing speed. The p...
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WO/2023/130111A1 |
Methods for forming a polycrystalline diamond compact (PDC) drill bit from catalyst-free synthesized polycrystalline diamonds are described. The polycrystalline diamonds are deposited within a mold. In some cases, a matrix body material ...
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WO/2023/127775A1 |
[Problem] To provide a composition which maintains the hydrophilicity and does not lose dispersibility or film properties even in an environment having a thermal history, while being adaptable to the heat generation during polishing. [So...
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WO/2023/119703A1 |
The purpose of the present invention is to provide a method and apparatus for producing a semiconductor crystal wafer, the method and apparatus being capable of easily and reliably producing a semiconductor crystal wafer of high quality....
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WO/2023/117745A1 |
The present invention relates to a method of making a diamond composite wherein a diamond green body is together with an infiltrant is placed onto a graphite crucible and wherein the graphite crucible is placed onto a carbon source such ...
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WO/2023/118477A2 |
The present invention relates to a method of producing gelatine, the method comprising the steps of: providing animal material containing collagen; cutting the animal material with at least one fluid cutting jet to form animal material s...
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WO/2023/121152A1 |
The present invention relates to a polishing device for delayering, the polishing device comprising: a stage which is installed to move along the X-axis and the Y-axis, and is rotatable about its own axis; a holder installed above the st...
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WO/2023/115867A1 |
A protection device for a telescopic cold cutting machine for a coal mine, and a method of use. The protection device comprises a handheld device and a protection support (1), wherein the protection support (1) is internally provided wit...
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WO/2023/120410A1 |
In the present invention, used is a blast medium that contains, as a main component, a first powdery/particulate substance which results from crushing a substance having a hardness equal to or less than the hardness of a member to be res...
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WO/2023/119847A1 |
The present invention relates to a substrate processing method and a substrate processing device for processing a substrate such as a wafer. In this substrate processing method, a substrate (W) having a notch (Nw) is rotated and moved in...
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WO/2023/122121A1 |
A device for providing abrasive to a cutting head in a liquid jet cutting system can include an abrasive inlet configured to receive abrasive from an abrasive source, an abrasive outlet downstream from the abrasive inlet and configured t...
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WO/2023/116255A1 |
A target distance adjustable nozzle and method suitable for abrasive water jet rail polishing, comprising a nozzle body (1), an outer cover (2), a lower baffle (3), a support frame (5), and an upper baffle (6) that are provided on the sa...
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WO/2023/119951A1 |
The present invention provides a double side polishing apparatus which is provided with: upper and lower polishing plates, to each of which a polishing cloth is bonded; a slurry supply mechanism which supplies a slurry to the space betwe...
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WO/2023/117082A1 |
The invention relates to a liquid abrasive cutting system comprising a nozzle arrangement (6) which has at least one liquid nozzle (24) and at least one gas outlet nozzle (34) located to the side of the liquid nozzle (24), the outlet dir...
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WO/2023/119684A1 |
The purpose of the present invention is to provide a method and a device for producing a semiconductor crystal wafer that make it possible to easily and reliably produce a semiconductor crystal wafer of high quality. This method is for...
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WO/2023/118459A1 |
The invention relates to a file (1) for creating a non-planar contour, in particular with transverse curvature, on a workpiece (11), comprising a longitudinal axis (3), at least one file element (5, 6) with an abrasive processing surface...
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WO/2023/116555A1 |
A large-area quartz wafer grinding apparatus and method. The grinding apparatus is provided with a base, supporting arm assemblies, a grinding disc, a rotating seat, a rotating motor, a carrying block and a disc trimming ring; the base i...
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WO/2023/120869A1 |
A retainer ring according to one embodiment comprises: a core part formed in a ring shape and including a metal material; and an injection part formed around the core part through molding so as to surround the core part, wherein the core...
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WO/2023/115946A1 |
A trimming device for production of a building composite wood formwork, comprising a workbench (1), a dust collecting box (3), and a rotating motor (6). The dust collecting box (3) is mounted on one side of the upper end of the workbench...
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WO/2023/115111A1 |
A method of operating an automated machine including operating an oscillating tool over a surface of a workpiece in order to provide a finish to the surface, switching off oscillating motion of a head of the tool, recalibrating dimension...
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WO/2023/119954A1 |
This method for cutting a silicon ingot is characterized in that a silicon ingot is cut by running a fixed-abrasive wire at a speed which has a maximum speed of at least 1,200 m/minute while supplying a coolant thereto which has a water ...
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WO/2023/115886A1 |
Provided are a method and device for processing a special-shaped curved glass contour. The method comprises the following steps: A: obtaining a theoretical track L; B: respectively calculating a transformation matrix Tt m between a tool ...
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WO/2023/112830A1 |
An information processing device (5) comprises: an information acquisition unit (500) that acquires a polishing process condition including top ring state information, polishing table state information, and polishing fluid supply nozzle ...
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WO/2023/112548A1 |
The present invention relates to a method for polishing a substrate by pressing an abrasive tape against a substrate such as a wafer. This method for polishing a substrate: stores in a database (21a) an actual polishing condition for a s...
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