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WO/2023/048265A1 |
A polishing pad including a polishing layer that is a molded product of a polyurethane composition, in which the polyurethane composition comprises 90 to 99.9% by mass of a thermoplastic polyurethane containing a non-alicyclic diisocyana...
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WO/2023/047684A1 |
A substrate processing apparatus 1 comprises: an indexer robot that takes a substrate W into and out of a carrier; a polishing unit 22 that polishes a back surface of the substrate while heating the substrate W; and a substrate transport...
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WO/2023/047690A1 |
Dust generated on a reverse face of a substrate by grinding with a grinder 96 is pushed out also toward the outer periphery of the grinder 96 by a centrifugal force. There, nitrogen gas is injected from an injection outlet 235. The dust ...
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WO/2023/041561A1 |
The invention relates to a device (1) for sewage pipe work, comprising: - a base unit (2), which can be moved in a sewage pipe; - a rotary head (3), which is disposed on the base unit (2) and can be rotated about an axis of rotation (A) ...
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WO/2023/042602A1 |
The present invention provides a processing machine in which a machine body drives at least one of a workpiece and a tool to process the workpiece using the tool. A processing chamber houses the workpiece, the tool, and a nozzle while is...
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WO/2023/041891A1 |
A method of manufacturing a moulded article is disclosed. The method comprises forming a body comprising a polymer material. The method further comprises polishing a portion of the body with a polishing element to smooth at least one imp...
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WO/2023/042406A1 |
[Problem] To provide a glass plate machining system where a movement distance of a machining device until arriving at a side edge of a small-sized glass plate where the area of the upper and lower surfaces is small can be shortened, an a...
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WO/2023/042385A1 |
Linear abrasive members (10A, 10B) are used as abrasive members for a polishing brush. The linear abrasive members (10A, 10B) comprise inorganic long fibers and a resin which is cured after having the inorganic long fibers immersed there...
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WO/2023/042384A1 |
Linear abrasive members (10) are used as abrasive members for a polishing brush. The linear abrasive members (10) comprise inorganic long fibers and a resin which is cured after having the inorganic long fibers immersed therein. The inor...
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WO/2023/039779A1 |
A wear-resistant cutter wheel, comprising a cutter wheel body (10) and a cutter wheel shaft (20) connected to the cutter wheel body (10). A center hole (11) into which the cutter wheel shaft (20) is inserted is formed in the center of th...
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WO/2023/035247A1 |
Embodiments of the present disclosure provide a chemical-mechanical polishing device and a control method therefor. The chemical-mechanical polishing device comprises a polishing platform which is adapted to carry a polishing pad and dri...
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WO/2023/038183A1 |
One embodiment of the present invention provides a technology for automatically performing a polishing process by using a robot and controlling the polishing process in real time by monitoring a current value of a spindle in real time. A...
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WO/2023/036903A1 |
A surface processing apparatus (500) comprises: - a surface processing device (200) to process a surface (SRF1), - a robot (ROBO1 ) to move the surface processing device (200) with respect to the surface (SRF1 ), - an electromagnetic act...
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WO/2023/036012A1 |
A wafer polishing system, at least comprising one polishing unit (1), wherein the polishing unit (1) comprises a wafer transmission channel (2) and at least two polishing modules (3); and the polishing modules (3) are located on both sid...
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WO/2023/038800A1 |
Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements. Each polishing element comprises an individual surface that forms a portion of a pol...
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WO/2023/036011A1 |
Disclosed in the present invention is a wafer polishing system, at least comprising a polishing unit, which comprises a fixed working station and two polishing modules, wherein the polishing modules are located on two sides of the fixed ...
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WO/2023/037272A1 |
Aspects of the present disclosure relate to a method of making an abrasive article. The method can include providing a combination of a mesh backing and a fastener. The mesh backing has a first side and a second side and the mesh backing...
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WO/2023/035810A1 |
A vertical wall construction method and a construction robot. The method comprises: a construction module (130) constructing an indoor vertical wall surface (S1); detecting an obstacle in the direction of construction, and acquiring posi...
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WO/2023/030999A1 |
The invention relates to a grinding disc for a grinding device (12), having a fastening interface (15) formed on a device side (26) of the grinding disc (11) facing the grinding device (12), wherein: on a working side (27) axially opposi...
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WO/2023/032716A1 |
Provided is a polishing composition which has an excellent ability to eliminate bulging around an HLM, and which can improve polishing rate. The polishing composition comprises abrasive grains, a basic compound, and water. In addition, t...
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WO/2023/032930A1 |
This polishing liquid contains cerium oxide abrasive grains and ammonium salt, and has a pH of at least 9.00. This polishing method uses the polishing liquid to polish a member to be polished that contains copper. This component manufact...
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WO/2023/030774A1 |
A method for grinding a semiconductor wafer, wherein the semiconductor wafer is machined in a material-removing manner by means of a grinding tool containing grinding teeth having a height h while supplying a cooling medium into a contac...
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WO/2023/034874A1 |
Examples are disclosed that relate to planarizing substrates without use of an abrasive. One example provides a method of chemically planarizing a substrate, the method comprising introducing an abrasive-free planarization solution onto ...
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WO/2023/032196A1 |
In a process in which grinding is performed after additive manufacturing, the present invention reduces the amount of a portion of a coating, formed during the additive manufacturing, that exceeds a thickness necessary for a product. Thi...
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WO/2023/034573A1 |
A chemical mechanical polishing pad comprising a polishing portion, the polishing portion comprising: a polymeric body; a plurality of polymer particles embedded within the body of the polymeric body, wherein at least a portion of the pl...
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WO/2023/032715A1 |
Provided is a polishing composition which can achieve both maintenance of a polishing rate and an HLM periphery protrusion elimination ability. This polishing composition contains grains, a basic compound, a salt of a sulfur-containing a...
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WO/2023/032714A1 |
Provided is a polishing composition capable of achieving both maintenance of a polishing rate and elimination of bulging of the periphery of a hard laser mark (HLM), the polishing composition comprising abrasive grains, a basic compound,...
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WO/2023/032197A1 |
This complex grinding machine comprises: a holding unit capable of holding and rotating a workpiece; an additive manufacturing unit that is movable with respect to the holding unit and melts a material while supplying the material to a s...
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WO/2023/032929A1 |
This polishing solution is for polishing a resin-containing polishing target member and contains an ether compound having a hydroxy group, and abrasive grains containing cerium oxide. This polishing method is for polishing a resin-contai...
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WO/2023/032489A1 |
Provided is a method for polishing a spectacle lens, the method having: a step for preparing a polishing pad in which a flocked polishing pad is provided to a polishing surface that comes into contact with a plastic spectacle lens, the f...
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WO/2023/032961A1 |
Provided are a glass member that excels in tactile sensation such as the feel of writing using an input pen and the feel of touching with a fingertip, an input device provided with the glass member, a pen input device, a mobile apparatus...
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WO/2023/033981A1 |
A backup pad assembly is presented that includes a backup pad with a cavity and a centerpost that is coupleable to the backup pad. The backup pad is configured to couple to a tool in a first configuration, without the centerpost, and in ...
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WO/2023/032928A1 |
Provided is a polishing liquid for polishing a member to be polished, said polishing liquid containing abrasive grains which include a cerium oxide, wherein the member to be polished contains a resin and particles which include a silicon...
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WO/2023/034962A1 |
Articles and methods regarding abrasive articles that include antimicrobial properties and improved abrasive performance and comprise a first fiber element comprising a woven or non-woven material; and a second fiber element comprising m...
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WO/2023/026814A1 |
The present invention provides a composition for chemical mechanical polishing, the composition being capable of chemically mechanically polishing a semiconductor substrate that contains ruthenium or molybdenum, while maintaining a stabl...
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WO/2023/026948A1 |
Provided are: a surface processing method for a GaN substrate, which is capable of performing surface processing on the GaN substrate in a short period of time; and a manufacturing method for a GaN substrate. This surface processing meth...
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WO/2023/024043A1 |
A PCB substrate burr removing apparatus for electronic device production. The apparatus comprises a collecting box (1), wherein two fixing supports (2) are fixedly mounted at the top of the collecting box (1); lifting grooves are provide...
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WO/2023/026171A1 |
The present disclosure discloses an apparatus (100) for performing superfinishing operation on a raceway of a bearing (200). The apparatus has an arm (10) extending from the superfinishing unit (100). The apparatus comprises a pivot (40)...
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WO/2023/027140A1 |
The purpose of the present invention is to provide a magnetic disk substrate and a method for manufacturing same, and a magnetic disk all of which make it possible to maintain high flatness, despite being thin, after a long-term use, be ...
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WO/2023/027932A1 |
A glass-based article with a textured surface exhibiting low haze is provided. The glass-based articles are produced by utilizing a combination of abrasion and etching, where hydrofluoric acid is not utilized. The process for producing t...
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WO/2023/025577A1 |
The present invention relates to a profiled structure for a component of a power tool, wherein the profiled structure has a front side and a rear side, and wherein the profiled structure has at least two beads on one of the two sides and...
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WO/2023/026813A1 |
Provided is a chemical mechanical polishing composition capable of chemically mechanically polishing a ruthenium- or molybdenum-containing semiconductor substrate while maintaining a stable polishing rate and suppressing the corrosion of...
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WO/2023/025148A1 |
A clamping mechanism and an electric tool. The clamping mechanism comprises a main body (1), a locking cap (2), a spring chuck (3) and an outer sleeve (5) which is sleeved on the periphery of the locking cap and can drive the locking cap...
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WO/2023/026778A1 |
The present invention provides a chemical mechanical polishing composition with which it is possible to suppress ruthenium corrosion and also perform chemical mechanical polishing of a semiconductor substrate containing ruthenium while m...
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WO/2023/024190A1 |
Provided in the present application are a grinding disk and a substrate cleaning device. The grinding disk comprises a thickness self-adaptive layer, and a base layer and a grinding sheet which are fixed to two opposite surfaces of the t...
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WO/2023/026779A1 |
The present invention provides a composition for chemical mechanical polishing, the composition being capable of chemically mechanically polishing a semiconductor substrate that contains ruthenium, while maintaining a stable polishing ra...
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WO/2023/026780A1 |
Provided is a composition for chemical mechanical polishing, with which chemical mechanical polishing can be carried out while suppressing corrosion of ruthenium and maintaining a stable polishing speed for a semiconductor substrate cont...
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WO/2023/023784A1 |
An axle buffer for buffing vehicle axles, the axle buffer comprising a buffer, a buffer rotating means and a buffer locating means, wherein buffer locating means comprises means to radially move the buffer relative to the axle surface an...
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WO/2023/028019A1 |
Described herein are textured glass-based articles. The textured glass-based articles may include a glass-based substrate including a first major surface and a second major surface. At least a portion of one or both of the first major su...
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WO/2023/026723A1 |
The present invention relates to a polishing device. The polishing device comprises: a plurality of window members (50) that transmit infrared rays, and a plurality of infrared radiation thermometers (51) that are disposed under the plur...
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