Title:
CHEMICALLY AMPLIFIED RESIST MATERIAL AND METHOD FOR FORMING RESIST PATTERN
Document Type and Number:
Japanese Patent JP2018025739
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a chemically amplified resist material that can exhibit excellent lithographic performance while maintaining good sensitivity.SOLUTION: The chemically amplified resist material of the present invention comprises (1) a polymer component that can be converted into soluble or insoluble with a developer by an action of an acid and (2) a component that generates a radiation-sensitive sensitizer and an acid by exposure. The (2) component comprises (a) a predetermined component, any two components in (a) to (c) components, or all of (a) to (c) components, in which the (a) component or the (c) component contains a radiation-sensitive first compound and a radiation-sensitive second compound. The first compound contains a first onium cation and a first anion; the second compound contains a second onium cation and a second anion different from the first anion; and when the first onium cation and the second onium cation are reduced into radicals, energy released by each onium cation is less than 5.0 eV.SELECTED DRAWING: None
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Inventors:
NAKAGAWA YASUSHI
NARUOKA TAKEHIKO
NAGAI TOMOKI
NARUOKA TAKEHIKO
NAGAI TOMOKI
Application Number:
JP2016217575A
Publication Date:
February 15, 2018
Filing Date:
November 07, 2016
Export Citation:
Assignee:
JSR CORP
International Classes:
G03F7/004; C08F212/14; C08F220/18; G03F7/039; G03F7/20; G03F7/38
Domestic Patent References:
JP2017040916A | 2017-02-23 | |||
JP2017040833A | 2017-02-23 |
Attorney, Agent or Firm:
Hajime Amano
Fujimoto Katsune
Yoshinori Ikeda
Hiroshi Ogawa
Koji Ishida
Kenichi Fujinaka
Fujimoto Katsune
Yoshinori Ikeda
Hiroshi Ogawa
Koji Ishida
Kenichi Fujinaka
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