Title:
導電材料、接続構造体及び接続構造体の製造方法
Document Type and Number:
Japanese Patent JP6767309
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive material that can improve joining strength at a solder joint at high temperature and can improve conduction reliability and insulation reliability between electrodes.SOLUTION: A conductive material has a binder resin, a plurality of solder particles, a flux, and a metal or a metal compound that is not solder. A viscosity of the conductive material at a temperature that is lower than a melting point of the solder particle by 10°C is 0.1 Pa s or more and 10 Pa s or less.SELECTED DRAWING: Figure 1
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Inventors:
Hidefumi Yaoi
Masahiro Ito
Hideaki Ishizawa
Kubota Keishi
Shujiro Sadanaga
Masahiro Ito
Hideaki Ishizawa
Kubota Keishi
Shujiro Sadanaga
Application Number:
JP2017103458A
Publication Date:
October 14, 2020
Filing Date:
May 25, 2017
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
H01B1/22; H01B1/00; H01B5/16; H05K1/14; H05K3/32; H05K3/34
Domestic Patent References:
| JP2004306092A |
Foreign References:
| WO2016013474A1 |
Attorney, Agent or Firm:
Patent business corporation Miya saki, table of contents patent office