Title:
成膜方法
Document Type and Number:
Japanese Patent JP6951584
Kind Code:
B2
Abstract:
A method of forming a film of this invention includes: rotating, inside a vacuum chamber, a to-be-processed substrate with a center of the to-be-processed substrate, while revolving the to-be-processed substrate on the same plane about a revolution shaft; and feeding a film-forming material from a film-forming source to form a predetermined thin film on a surface of the to-be-processed substrate. Provided that a goal film thickness of the thin film to be formed be defined as T, and that a film thickness of the thin film to be formed on the to-be-processed substrate in one revolution period be defined as D, the method further includes a setting process for setting a ratio α of rotation angular velocity Ωrot to a revolution angular velocity Ωrev of the to-be-processed substrate to a value satisfying the following formula (1)α≥6/log10(T/D) (1)
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Inventors:
Shuji Kodaira
Takahashi Iron Soldier
Toshiishi
Norifumi Yamamura
Hiroaki Katagiri
Junya Kubo
Masaaki Suzuki
Takahashi Iron Soldier
Toshiishi
Norifumi Yamamura
Hiroaki Katagiri
Junya Kubo
Masaaki Suzuki
Application Number:
JP2020538736A
Publication Date:
October 20, 2021
Filing Date:
December 11, 2019
Export Citation:
Assignee:
ULVAC, Inc.
International Classes:
C23C14/34; C23C14/50; H01L21/285
Domestic Patent References:
| JP2002220663A | ||||
| JP2210636A | ||||
| JP2002097570A | ||||
| JP1252775A | ||||
| JP2007039710A |
Attorney, Agent or Firm:
Seiryu Corporation