Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5769734
Kind Code:
A
Abstract:
PURPOSE:To eliminate the accurate mask positioning in a manufacture of a semiconductor device by emitting ultraviolet ray to a resist through the first mask of a wiring pattern including contacting hole, the exposing and developing the pattern of the same as or smaller than the contacting hole throught the second mask. CONSTITUTION:An Si oxidized film 4 is formed on the area except the contacting hole 2, a photoresist 6 is coated on an Si wafer 5 fored with a thin aluminum film 3 thereon, and ultraviolet ray is emitted through the mask. A photosensitive part 6a and non-photosensitive part 6b are formed with improper mask positioning. The ultraviolet ray is emitted through the mask 7 of the pattern of the hole 8 having the same size as the contacting hole 2 or smaller than the hole 2, and is developed. In this manner, the mask positioning can be not so suitably performed by completely covering the wire on the contacting hole.
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Inventors:
OSADA YOSHIHIRO
Application Number:
JP14594580A
Publication Date:
April 28, 1982
Filing Date:
October 17, 1980
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/3213; G03F7/20; H01L21/027; H01L21/28; (IPC1-7): H01L21/28; H01L21/30; H01L21/88