Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PATTERN FORMING METHOD, ITS CURED MATERIAL, AND CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2007052359
Kind Code:
A
Abstract:

To provide a method of forming a cured material which deforms less before and after the postbaking by using a positive photosensitive resin composition.

This method include steps in this order: (1) a step of forming a coated film on a substrate by using a positive photosensitive insulation resin composition containing (A) an alkali solubile resin and (B) a quinonediazido group containing compound, (2) a step of partly exposing this film, (3) a step of developing, (4) a step of exposing the developed film, and (5) a step of heating.


Inventors:
SASAKI HIROBUMI
HASHIGUCHI YUICHI
ITO JUNJI
GOTO HIROFUMI
Application Number:
JP2005238854A
Publication Date:
March 01, 2007
Filing Date:
August 19, 2005
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
JSR CORP
International Classes:
G03F7/023; G03F7/004; G03F7/40; H05K3/00
Domestic Patent References:
JP2004333963A2004-11-25
JP2004240144A2004-08-26
JP2004163923A2004-06-10
JP2003215802A2003-07-30
JP2002287351A2002-10-03
JP2002139835A2002-05-17
JP2005506579A2005-03-03
JP2002341521A2002-11-27
JPH0643637A1994-02-18
JP2003114529A2003-04-18
JP2003215789A2003-07-30
Foreign References:
WO2003029898A12003-04-10
Attorney, Agent or Firm:
Shunichiro Suzuki
Koji Makimura
Chihata Takahata
Toru Suzuki