To provide a sputtering device which allows the easy execution of the adjustment of a film forming range to a substrate and the execution of the removal of the films adhered to a mask body with good workability by easily deforming the mask body.

This sputtering device has the frame-shaped mask body 28 which controls the film forming range on the substrate 8 by masking the peripheral edges of the substrate 8 and a mask mounting plate 12 for fixing the mask body 28. The mask body 28 is constituted by annularly arranging plural pieces of mask blanks 29a to 29d of a shape obtd. by dividing the frame and fixing the respective mask blanks 29a to 29d to the mask body mounting plate 12 in the mounting state of allowing the change of the respective positions.