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Title:
Substrate processing device
Document Type and Number:
Japanese Patent JP6017999
Kind Code:
B2
Abstract:
In a substrate processing apparatus (1), an enlarged sealed space (100) is formed by bringing a cup part (161) that forms a lateral space (160) around the outer periphery of a chamber (12) into contact with a chamber lid part (122) separated from a chamber body (121). A scan nozzle (188) is attached to the cup part (161) in the lateral space (160) and supplies a chemical solution onto a substrate after moving to above the substrate through an annular opening (81). During processing for cleaning the substrate and processing for drying the substrate, the scan nozzle (188) is housed in the lateral space (160) and an upper opening of the chamber body (121) is closed by the chamber lid part (122) to isolate the chamber space (120) from the lateral space (160) and seal the chamber space (120). Thus, the chamber space (120) can be isolated from the scan nozzle (188). This consequently prevents a mist or the like of the chemical solution supplied from the scan nozzle (188) from adhering to the substrate.

Inventors:
Yasuhiko Ohashi
Application Number:
JP2013052915A
Publication Date:
November 02, 2016
Filing Date:
March 15, 2013
Export Citation:
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Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/304; H01L21/027; H01L21/306
Domestic Patent References:
JP2011216608A
JP2009147152A
JP2011211092A
Attorney, Agent or Firm:
Masahiro Matsusaka
Tsutomu Tanaka
Masamichi Ida



 
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