Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ANISOTROPIC CONDUCTIVE FILM AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/052130
Kind Code:
A1
Abstract:
An anisotropic conductive film which comprises: a conductive particle-containing layer that contains particles, each of which has a conductive core material and an insulating coating film that is formed from an active energy ray-curable resin composition on the surface of the conductive core material, and a thermosetting resin; and an insulating adhesive layer that contains a thermosetting resin.

More Like This:
JPH11135181SEPARABLE CONNECTOR
JPWO2018174065Conductive materials and connecting structures
JP4543762A method for producing a perforated porous resin base material and a porous resin base material in which the inner wall surface of the perforation is made conductive.
Inventors:
YAMAMOTO JUN (JP)
Application Number:
PCT/JP2015/075758
Publication Date:
April 07, 2016
Filing Date:
September 10, 2015
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01R11/01; H01B5/16; H01R43/00
Domestic Patent References:
WO2012115076A12012-08-30
WO2006093315A12006-09-08
Foreign References:
JPH0696620A1994-04-08
JP2010239153A2010-10-21
JP2011211245A2011-10-20
JP2012023024A2012-02-02
JP2000178511A2000-06-27
JP2013028675A2013-02-07
JP2010272546A2010-12-02
Attorney, Agent or Firm:
HIROTA, Koichi et al. (JP)
Koichi Hirota (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING SAME

Next Patent: IMAGE RECORDING METHOD