POLISHING PAD FOR SEMICONDUCTOR WAFER, POLISHING MULTILAYERED BODY FOR SEMICONDUCTOR WAFER HAVING SAME, AND METHOD FOR POLISHING SEMICONDUCTOR WAFER

WIPO Patent Application WO/2005/104199

A1

A polishing pad, a polishing multilayered body and a polishing method for semiconductor wafer which enables optical end point detection to be carried out without lowering the polishing performance. The polishing pad comprises a substrate (11) for polishing pad having a through hole, and a translucent member (12) fitted in the through hole wherein the translucent member contains a water-insoluble matrix material (1,2-polybutadiene), and water-soluble particles (β-cyclodextrin) dispersed in the water-insoluble matrix material. Assuming the total of the water-insoluble matrix material and the water-soluble particles is 100 vol%, the water-soluble particles is less than 5 vol%. The polishing multilayered body comprises a support layer which is provided on the back side of the polishing pad. These polishing pad and polishing multilayered body can be provided with a fixing layer (13) on the back side.

JP2002059356	POLISHING METHOD OF SEMICONDUCTOR WAFER
JP2007007771	POLISHING PAD AND POLISHING MACHINE
JP2001244223	POLISHING PAD

SHIHO HIROSHI (JP)
HOSAKA YUKIO (JP)
HASEGAWA KOU (JP)
KAWAHASHI NOBUO (JP)

PCT/JP2004/005963

November 03, 2005

April 23, 2004

Click for automatic bibliography generation  

JSR CORP (JP)
SHIHO HIROSHI (JP)
HOSAKA YUKIO (JP)
HASEGAWA KOU (JP)
KAWAHASHI NOBUO (JP)

B24B37/20; B24D7/12; B24D13/14; H01L21/304; (IPC1-7): H01L21/304

JP2002324769A	2002-11-08
JP2003285260A	2003-10-07
JP2004134539A	2004-04-30
JPH097985A	1997-01-10
JP2000326220A	2000-11-28
JPH11512977A	1999-11-09
JP2002324769A	2002-11-08

See also references of EP 1739729A4

Kojima, Seiji (7-26 Jingu 3-chome, Atsuta-k, Nagoya-shi Aichi, JP)

View/Download PDF      PDF Help

Previous Patent: SEMICONDUCTOR SUBSTRATE AND PROCESS FOR FABRICATING THE SAME

Next Patent: SUCKING APPARATUS