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WO/2006/009634A1 |
A chemical-mechanical polishing pad, and method of polishing a substrate using a polishing pad, comprising (a) a resilient subpad, and (b) a polymeric polishing film substantially coextensive with the resilient subpad, wherein the polyme...
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WO/2006/003712A1 |
A rotating polishing tool capable of finishing a polished surface to a specified surface roughness and having excellent durability, wherein a generally cylindrical polishing member (3) is formed of a pair of polishing units (9) at both e...
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WO/2005/123336A2 |
Provided is a polishing apparatus (100) and polishing pad (104), intended for polishing a substrate, and designed for improved flow and distribution of a polishing composition to the area of interaction between the pad and substrate. In ...
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WO/2005/120775A1 |
A method of planarization of a heteroepitaxial layer (121) comprises a step of chemical-mechanical polishing the surface of the heteroepitaxial layer with a polishing pad (14) having a compressibility comprised between 2 and 15 % and a s...
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WO/2005/118223A1 |
A polishing pad (20) for polishing a wafer (32) or other article, the pad having a groove network (60) configured to increase the residence time polishing medium (46) on the pad. The groove network has a first portion (72) that may exten...
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WO/2005/113198A2 |
A cleaning element (36) for a cement floor surface mounted to a housing (32). Each cleaning element has a flat flexible abrasive surface (39) that is transversely positioned to the direction of motion to provide flex during cleaning of a...
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WO/2005/110675A2 |
An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a po...
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WO/2005/102604A1 |
An abrasive cloth which comprises an article in a sheet form having, in at least a part thereof, nano-fibers comprising a thermoplastic polymer and having a number average single fiber fineness of 1 × 10-8 to 2 × 10-4 dtex wherein the ...
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WO/2005/102606A1 |
Nonwoven abrasive articles, particularly lofty nonwoven abrasive articles, with a textured, non-planar surface and an abrasive coating (14) thereon. The coating may cover the entire surface or only portions of the surface. The textured s...
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WO/2005/104199A1 |
A polishing pad, a polishing multilayered body and a polishing method for semiconductor wafer which enables optical end point detection to be carried out without lowering the polishing performance. The polishing pad comprises a substrate...
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WO/2005/099962A1 |
The invention provides a chemical-mechanical polishing pad comprising a polishing layer (10) comprising a hydrophobic region (30), a hydrophilic region (40), and an endpoint detection port (20). The hydrophobic region is substantially ad...
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WO/2005/099963A1 |
The invention provides a polishing pad substrate comprising a copolymer, wherein the copolymer has at least one hydrophilic repeat unit and at least one hydrophobic repeat unit. The invention also provides a polishing pad substrate compr...
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WO/2005/095058A1 |
The invention relates to a grinding head for a grinding device, comprising a support part (10) and a coating (13) that is disposed on the support part and forms a rotationally symmetrical grinding surface (21). According to the invention...
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WO/2005/087436A1 |
The invention concerns a sanding element with a succession of overlapping lamellas (3, 4) containing sanding grains (9), characterised in that these lamellas (3, 4) are alternately formed of sanding lamellas (3) and compressible lamellas...
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WO/2005/081300A1 |
A polishing pad for polishing a semiconductor wafer which has a polishing layer and a cushion layer, characterized in that said polishing layer is formed from an expanded polyurethane and has a flexural modulus of elasticity of 250 to 35...
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WO/2005/077601A2 |
Rotary grinding tool of cylindrical shape with a hole with attached mounting shank consists of a grinding layer (1) based on non wowen textile, resin and grinding particles, applied to load bearing flexible layer (2), with bottom part (3...
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WO/2005/077602A1 |
Disclosed is a base pad of polishing pad, which is used in conjunction with polishing slurry during a chemical-mechanical polishing or planarizing process, and a multilayer pad using the same. Since the base pad according to the present ...
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WO/2005/072913A1 |
An abrasive composite material that includes a polymer layer comprising one or more polyarylene sulfides, particularly polyphenylene sulfide, and a plurality of abrasive particles at least partially embedded in the polymer layer. The com...
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WO/2005/072036A1 |
A molded brush segment (10) having a plurality of integrally molded bristles (18) extending from a generally planar center portion (12). The brush segment is molded from a moldable polymer, such as a thermoplastic elastomer, and has a pl...
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WO/2005/068133A1 |
Disclosed is a device for polishing an optical surface, particularly a surface (16) of a spectacle lens (12). A polishing head (20) is provided with a polishing tool (22) comprising a first, preferably rigid body (24), a second, elastic ...
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WO/2005/063439A1 |
The invention relates to a hand machine tool (10) with a clamping device (30, 32, 34, 36, 44), for clamping disc-shaped tools (27) of varying thickness to at least one flange (30, 32), with a clamping means (36), passing through the tool...
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WO/2005/060810A1 |
The present invention discloses a disposable scrubbing product for use in household cleaning or personal care applications. The scrubbing product (330) of the invention is a multi-layer laminate product and generally includes at least tw...
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WO/2005/061176A1 |
The present invention relates to a structure for fixing grinding papers applied to a wheel paper of a circular plate shape, which is coupled to a rotary shaft of a hand-held grinder to support and rotate the grinding papers. More particu...
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WO/2005/061177A1 |
Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom ...
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WO/2005/058543A1 |
The present invention relates to procedures and compositions for CMP materials used to planarize metals, such as Cu and Al, used in fabricating semiconductor devices. Optimization of the CMP process can be achieved by decreasing the role...
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WO/2005/056235A1 |
A buffing and polishing ball made of a compressible polymeric foam material is formed by slitting a body of foam material in a substantially uncompressed state (1) from an outside surface of the body in a direction generally perpendicula...
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WO/2005/051599A1 |
The invention relates to composite abrasive bodies, comprising at least one abrasive support (1), at least one abrasive (2), on the surface of which abrasive particles (3) are provided and at least one cured, two-component polyurethane o...
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WO/2005/042810A2 |
This invention provides a membrane-mediated electropolishing process for polishing and/or planarizing metal work pieces. The work piece is wetted with a low-conductivity fluid. The wetted work piece is contacted with a first side of a ch...
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WO/2005/039820A1 |
A device (1) for polishing shaped pieces made of hard stones and the like, comprising an abrading body made of bristles (3) exhibiting an elastic deformability such as to conform to the configuration of the pieces be worked (P, P’) hav...
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WO/2005/037486A2 |
An improved sanding wheel configured to rotate axially for sanding or polishing milled contours that will provide sharp edges and corners in the workpiece. The preferred sanding wheel has a cylindrical body with a plurality of segments e...
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WO/2005/035194A2 |
The following is a description of a stacked pad (15) for chemical mechanical polishing and/or planarizing substrates. In one embodiment, the stacked pad includes a top pad (20) and a subpad (40) where the modulus of the top pad (20) subs...
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WO/2005/035187A2 |
A buffing and polishing pad or other structure uses extremely fine microfibers of less than 1 denier. Preferred fibers are less than 0.7 denier, and in some cases considerably less. The currently most preferred embodiment is 50% fiber ha...
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WO/2005/032765A1 |
The invention provides a polishing pad for chemical-mechanical polishing comprising (a) a first polishing layer (10) comprising a polishing surface (12) and a first aperture having a first length and first width, (b) a second layer (20) ...
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WO/2005/028157A1 |
The present invention provides in one embodiment, a polishing pad (100) for chemical mechanical polishing. The polishing pad comprises a polishing body (110). The polishing body comprises a thermoplastic foam substrate (115) having a sur...
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WO/2005/023487A1 |
A polishing pad having a novel structure is disclosed which enables to stably form a thin, generally uniform film of a slurry on the polishing surface, and thus enables to stably improve accuracy and efficiency in polishing of semiconduc...
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WO/2005/023491A1 |
The inventive tool comprises a variable set of machining means (3-6). The overall amount of machining means (3-6) is divided into partial amounts of machining means having different working angles (15, 16, 17) in relation to the directio...
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WO/2005/016597A1 |
The present invention is directed to a polishing pad having a sublayer and a polishing layer. The surface of the outer peripheral edge of the sublayer can be at least partially treated to reduce the absorption or permeation of polishing ...
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WO/2005/009681A1 |
A method for providing a mirror-finish on the edge of a recording-media-disk raw plate is disclosed, by which a pit of the edge of the recording-media-disk raw plate is removed in a short time with simple procedure and low cost. Also dis...
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WO/2005/005100A1 |
A viscoelastic polisher used for polishing. In the viscoelastic polisher, a hole portion with a predetermined inner peripheral radius is formed in the center portion of the polisher and groove portions are formed in a main surface of a c...
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WO/2005/000527A2 |
The invention is directed to a multi-layer polishing pad (10) for chemical-mechanical polishing comprising a polishing layer (12) and a bottom layer (14), wherein the polishing layer and bottom layer are joined together without the use o...
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WO/2005/000525A1 |
The invention provides a polishing pad comprising a body having a top surface (10) comprising a first set of grooves (12) with a first depth and first width and a bottom surface comprising a second set of grooves (16) with a second depth...
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WO/2005/000526A1 |
The invention provides a polishing pad for chemical-mechanical polishing comprising a body, a polishing surface, and a plurality of elongated pores, wherein 10% or more of the elongated pores have an aspect ratio of 2:1 or greater and ar...
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WO/2004/107428A1 |
A production method for a semiconductor wafer capable of reducing fine surface undulations produced by wire-saw slicing or double-disc grinding by semi-fixed abrasive-grain grinding using free abrasive grains, and simplifying a conventio...
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WO/2004/103642A1 |
The present invention concerns a grinding element for mounting in a recess (41) in a surface of a cylindric drum (42) and including a retainer means (2) designed with outer sidewalls that are complementary to sidewalls of the recess (41)...
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WO/2004/105113A1 |
A polishing body for CMP polishing is disclosed which is preferably used in a CMP polishing method which enables to prevent excess polishing of the peripheral surface of a wafer. This polishing body for CMP polishing is composed of a pol...
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WO/2004/103643A1 |
A brush module (6) for a rotating grinding brush, said brush module comprising: an elongate body part (7); at least one abrasive cloth (9) protruding from the body part (7); a plurality of bristles (8) extending from the body part (7) es...
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WO/2004/101223A1 |
A substrate polishing apparatus polishes a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus according to the present invention has a rotatable table (12) having a polishing p...
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WO/2004/098831A1 |
An abrading machine is disclosed for abrasion of substantially plane items by use of rotating abrading discs (5, 5'), which are moved simultaneously forwards and backward transverse to the item and which preferably has downward extending...
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WO/2004/096495A1 |
The present invention concerns a grinding wheel (1) including a circular wheel that rotates about a central axis and with a surface (2) to which edge parts of a number of sand paper items (3) are fastened, and that the surface (2) has in...
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WO/2004/094108A1 |
The present invention relates to a polishing pad. In particular, the polishing pad of the present invention can include a window area. The window area can be formed in the pad using a cast-in-place process. The polishing pad of the prese...
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