Title:
BRITTLE MATERIAL SUBSTRATE PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2015116774
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a brittle material substrate processing method capable of easily and surely parting, compared with a conventional method, or, increasing end surface strength of a piece obtained after parting compared with conventional strength.SOLUTION: The method for processing a brittle material substrate along a parting planned position is configured so that: a radiation step for light focus pulse laser beam, and scanning and radiating the pulse laser beam along a parting planned position set on a surface of the brittle material substrate under a radiation condition in which melting ablation occurs at an area to be radiated by the pulse laser beam, is repeated by multi times (for example, twice) to one parting planned position, therefore a parting origin along the parting planned position, is formed.
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Inventors:
FUKUHARA KENJI
ARAKAWA MIKI
ARAKAWA MIKI
Application Number:
JP2013262723A
Publication Date:
June 25, 2015
Filing Date:
December 19, 2013
Export Citation:
Assignee:
MITSUBOSHI DIAMOND IND CO LTD
International Classes:
B28D5/00; B23K26/364; C03B33/07; C03B33/08
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita
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