To provide a semiconductor package for making contribution to a small-size and thin body of a semiconductor device, along with easy operation of controlling and making the semiconductor device thin.

In a semiconductor package, a hole for storing a semiconductor element is formed on an insulating substrate, having a conductive part with a prescribed pattern. At the given position of the substrate, a through-hole with one end stuffed with a conductive part is formed, so that the through-hole is filled with a low melting point metal with the thickness of the metal equal to or higher than that of the substrate to form an outside connection terminal.