Title:
METHOD FOR FORMING COATING FILM, APPARATUS FOR FORMING COATING FILM, AND STORAGE MEDIUM
Document Type and Number:
Japanese Patent JP2017107919
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide such technology that film thickness of a coating film can be adjusted upon forming the coating film on a substrate by a spin coating method.SOLUTION: After a step of forming a liquid film by supplying a resist solution to a center part of a wafer W as a substrate while holding and rotating the wafer W with a spin chuck 11, a reflow step is carried out in which the wafer W is rotated at a rotational speed within a ±50 rpm range with respect to the rotational speed at the time of ending the supply of the resist solution so as to make the resist liquid film uniform. While carrying out the reflow step, gas is supplied to the surface of the wafer W. Then the rotational speed of the wafer W is increased to adjust the film thickness to a target film thickness, and then the rotational speed is decreased and the resist film is dried. Since the film thickness can be adjusted not only by controlling the rotational speed but by supplying gas to change the fluidity of the liquid film, resist films (coating films) having a broader range of film thickness can be formed from one resist solution (coating liquid).SELECTED DRAWING: Figure 4
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Inventors:
YOSHIHARA KOSUKE
NIWA TAKAFUMI
NIWA TAKAFUMI
Application Number:
JP2015238838A
Publication Date:
June 15, 2017
Filing Date:
December 07, 2015
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/027; B05C11/08; B05D1/40; B05D3/00; B05D3/04
Domestic Patent References:
| JP2008060462A | 2008-03-13 | |||
| JPH01207164A | 1989-08-21 | |||
| JP2002299204A | 2002-10-11 | |||
| JP2015026792A | 2015-02-05 | |||
| JP2001291660A | 2001-10-19 | |||
| JP2002134399A | 2002-05-10 | |||
| JP2006156565A | 2006-06-15 |
Attorney, Agent or Firm:
Toshio Inoue
Tomoaki Miida
Tomoaki Miida