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WO/2023/220296A1 |
A broadband multilayer ceramic capacitor may include a first external termination and a second external termination. A first portion of the first external termination may be spaced apart from a first portion of the second external termin...
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WO/2023/220679A1 |
Disclosed embodiments may include a power converter package including devices stacked vertically. The devices include a first device (110a) and a second device (110b). The first device (110a) includes a first switched capacitor circuit (...
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WO/2023/218955A1 |
Provided is a laminated ceramic capacitor having high reliability while still being compact and having a large capacity. A laminated ceramic capacitor 1 has a laminated body 10 provided with: an internal layer section 30 formed by alte...
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WO/2023/214504A1 |
The present disclosure provides an electronic component in which variations of the capacitance of a capacitor in a manufacturing process are reduced while suppressing the proportion of the area occupied by the capacitor in the electronic...
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WO/2023/210892A1 |
The present application can provide a conductive paste composition that has excellent viscosity characteristics and is easy to print and disperse, even with a small amount of conductive metal powder, by substituting a portion thereof, fo...
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WO/2023/210134A1 |
The present invention realizes a capacitor which uses a plurality of fiber-like conductive members, and in which the number of occurrences of short paths is reduced without substantially diminishing capacitance density. Provided is a cap...
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WO/2023/211721A1 |
A capacitor assembly comprises a laminar bus plate arrangement having at least one first polarity bus plate and at least one second polarity bus plate separated by a sheet-like insulator. At least one pair of bus terminals have a first p...
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WO/2023/210465A1 |
Provided are a multilayer ceramic capacitor in which cracking is less likely to occur, and a method for mounting a multilayer ceramic capacitor. A multilayer ceramic capacitor 1 of the present invention comprises: a multilayer body 2 whi...
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WO/2023/204176A1 |
Provided is a dielectric resin film that makes it possible to form a film capacitor that has excellent self-recovery capability and does not easily lose capacitance when high voltage is applied. A dielectric resin film according to the p...
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WO/2023/204298A1 |
This electronic component manufacturing device includes a grip plate (22, 25, 27), and the grip plate has a jig (20A, 20B) having a plurality of holes (23, 26, 28-1) into which each one of a plurality of electronic components (10) is ins...
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WO/2023/203754A1 |
A capacitor unit (11) comprises: a plurality of capacitor elements (21a, 21b, 21c, 21d); and one or a plurality of heat transfer members (22a, 22b, 22c), each of which is provided in a location neighboring at least one of the plurality o...
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WO/2023/199695A1 |
The present invention provides a multilayer ceramic electronic component 2 which comprises a ceramic layer 3 and an electrode 9 that is in contact with the ceramic layer 3, wherein: the ceramics contained in the ceramic layer 3 include a...
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WO/2023/195451A1 |
This ceramic electronic component comprises a main body (1), which has ceramic as the main material, has a first surface (41) and main body side surfaces perpendicular to the first surface (41), and a side-surface electrode (3) arranged ...
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WO/2023/195396A1 |
This film capacitor is fixed to a housing and comprises: a capacitor element having a stacked body of a dielectric film and an internal electrode, and end surface electrodes formed respectively on one end surface and the other end surfac...
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WO/2023/195526A1 |
An electrolytic capacitor lead terminal 1 comprises a rolled part 12, a rod-shaped part 18, and a lead wire 20. A side peripheral surface of the rolled part has: a first main surface 14a and a second main surface 14b; a pair of sheared s...
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WO/2023/190616A1 |
Provided is a conductive paste which can further improve adhesion to a substrate. This conductive paste comprises a conductive powder, a binder resin, an additive, and an organic solvent, wherein the glass transition point of a dried b...
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WO/2023/189919A1 |
The present invention provides a capacitor (1) comprising a body element (10) on which a dielectric layer (13) made of a thermosetting resin and a metal electrode layer (11) are laminated or wound, and an external electrode (20) to which...
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WO/2023/189718A1 |
A multilayer ceramic capacitor 10 comprises: a capacitor body 11 that includes a plurality of laminated dielectric layers 12, a plurality of first inner electrodes 13a, and a plurality of second inner electrodes 13b, and that has a first...
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WO/2023/189749A1 |
The purpose of the present invention is to provide a multilayer ceramic capacitor (1) that is resistant to cracking due to firing. The multilayer ceramic capacitor (1) comprises a stack (10) in which dielectric layers (20) and internal e...
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WO/2023/190613A1 |
Provided is a conductive paste of which adhesion with a base material is further improved. The conductive paste comprises a conductive powder, a binder resin, an additive, and an organic solvent, the additive comprising a compound havi...
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WO/2023/190452A1 |
[Problem] To provide: a barium titanate particulate powder which is fine and highly crystalline, can be suitably used as a raw material for a small-sized, high-performance electronic component or optical component due to the easy dispers...
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WO/2023/188598A1 |
The present invention addresses the problem of providing a polypropylene film that has excellent withstand voltage characteristics and reliability in high-temperature environments, and is suitable for a capacitor or the like used under h...
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WO/2023/190615A1 |
Provided is a conductive paste with which adhesion to a base material can be further enhanced. This conductive paste contains a conductive powder, an additive, a binder resin, and an organic solvent, wherein the conductive paste contai...
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WO/2023/189845A1 |
The present invention provides a resin composition for a ceramic green sheet, the composition having excellent solvent solubility and enabling fabrication of a ceramic capacitor having excellent reliability by reducing the amount of fine...
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WO/2023/189926A1 |
This semiconductor device comprises a substrate, a passivation film that covers the substrate, a first resin film that is provided on the passivation film, a capacitor that is provided on the passivation film and is positioned above the ...
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WO/2023/189448A1 |
Provided is a layered ceramic capacitor that suppresses cracking and chipping of a laminate, even when stress is applied to a substrate on which the layered ceramic capacitor is mounted and the substrate bends. A layered ceramic capaci...
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WO/2023/189678A1 |
The present invention provides an electronic device and a solid-state battery having high adhesion to terminal electrodes. The present invention comprises: a battery element body 140 having a positive electrode layer 110, a negative elec...
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WO/2023/189300A1 |
The present invention provides a method for producing a printed wiring board with a built-in capacitor, the printed wiring board exhibiting excellent adhesion between a circuit and a dielectric layer, with high productivity, while reduci...
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WO/2023/190614A1 |
Provided is an electroconductive paste making it possible to further improve adhesion to a substrate. The electroconductive paste contains an electroconductive powder, an additive, a binder resin, and an organic solvent. The electrocon...
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WO/2023/182051A1 |
An electronic component (102) comprises a semiconductor substrate (1), an insulator layer (2) formed on the top surface layer side of the semiconductor substrate (1), internal electrodes (3A1, 3A2, 3B) formed inside the insulator layer (...
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WO/2023/181748A1 |
In the present invention, a solid electrolytic capacitor (100) comprises a capacitive element (10) and a cathode metal (70). The capacitive element (10) has: (i) an anode body (20) that includes a sintered compact in which a dielectric o...
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WO/2023/181803A1 |
An electronic component (101) comprises a semiconductor substrate (1), an insulator layer (2) formed on the semiconductor substrate (1), a plurality of conductor layers formed on the insulator layer (2), a dielectric layer (4) formed on ...
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WO/2023/182236A1 |
Provided is a dielectric film configured such that a polymer resin having a particle diameter of 10 nm or less forms a continuous phase.
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WO/2023/176684A1 |
The present invention addresses the problem of reducing impedance. In a capacitor (100), a plurality of first metal layers (11) are connected to a first external electrode, and separated from a second external electrode. A plurality of s...
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WO/2023/176381A1 |
The disclosed capacitor includes: an anode body (111) that has a dielectric layer (112) formed on a surface thereof; a cathode extraction layer (131); and an n-type semiconductor layer (120) that is disposed between the dielectric layer ...
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WO/2023/176462A1 |
Provided is a film capacitor comprising: a film capacitor element having a first electrode and a second electrode; a first bus bar having a first connection portion connected to the first electrode and a first terminal portion for extern...
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WO/2023/176683A1 |
Provided is an electronic component having excellent moisture resistance. The present invention comprises an electronic component element 2 and a barrier layer 3 disposed on the outer side of the electronic component element 2. The barri...
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WO/2023/176594A1 |
The present invention addresses the problem of providing a heat-resistant, humidity-resistant, and highly reliable ceramic electronic component by, in a plating step for forming an external electrode, preventing a plating solution from i...
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WO/2023/176780A1 |
This electronic component (101) comprises a semiconductor substrate (1), multiple insulator layers (2) formed on this semiconductor substrate (1), multiple conductor layers insulated by the insulator layers (2), and interlayer connection...
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WO/2023/176538A1 |
This multilayer ceramic capacitor includes a capacitor body 1 in which a plurality of dielectric layers, a plurality of first internal electrodes, and a plurality of second internal electrodes are stacked, first via conductors 5 provided...
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WO/2023/171394A1 |
The present invention provides an electronic component which is capable of suppressing the formation of a pinhole in a plating layer even if a corner part of a ceramic element is not completely covered with a base layer. The present inve...
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WO/2023/167229A1 |
According to the present invention, a through-hole for a positive electrode is formed so as to penetrate a flat film-type capacitor element in the thickness direction. A plurality of flat film-type capacitor elements are stacked in a pos...
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WO/2023/167228A1 |
A solid electrolytic capacitor according to the present invention is provided with: a sheet laminate formed by alternately laminating a plurality of flat cathode electrode foils and a plurality of flat capacitor elements, in which dielec...
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WO/2023/166702A1 |
Provided is a power supply unit in which confirmability of solder lifting is improved at a soldering section between a through-hole of a circuit board and a lead portion of a capacitor. A power supply unit 10 includes: a capacitor 12 f...
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WO/2023/162557A1 |
The present invention provides: a biaxially stretched polypropylene film that exhibits high insulation breakdown strength even at high temperatures; and a metallized film using said biaxially stretched polypropylene film. The present i...
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WO/2023/162406A1 |
[Problem] To provide a thin film capacitor in which a pair of terminal electrodes can be disposed on the same surface. [Solution] A thin film capacitor 1 is provided with: metal foil 10 that has an unroughened central section 13 and a ro...
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WO/2023/162568A1 |
[Problem] To provide a thin film capacitor having a large capacitance. [Solution] A thin film capacitor 1 comprises: a metal foil 10, the main surfaces 11, 12 of which have been roughened; a dielectric film 13 which covers the main surfa...
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WO/2023/163069A1 |
The electronic circuit module according to the present invention comprises: an insulating body; at least one among a capacitor, a coil, an inductor via, and a coupling line having two conductors electromagnetically coupled with each othe...
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WO/2023/162297A1 |
According to the present invention, an internal electrode layer 3 includes therein a plurality of inner ceramic particles 36a within an observation range of a cross-section intersecting the internal electrode layer 3. The position of the...
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WO/2023/157705A1 |
A solid electrolytic capacitor 1 comprises: a positive electrode plate 10 having a porous layer 12 on at least one of its major surfaces; a dielectric layer 20 provided on the surface of the porous layer 12; a negative electrode layer 30...
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